THERMAL INFORMATION

P

D(MAX)

+

T

J(MAX)

* T

A

R

q

JA

+ 125°C * 85°C

84

°C W

+ 476 mW

(7)

PACKAGE INFORMATION

Package Dimensions

TPS63010

TPS63011

TPS63012

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires

special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added

heat sinks and convection surfaces, and the presence of other heat-generating components affect the

power-dissipation limits of a given component.

Three basic approaches for enhancing thermal performance are listed below.

1. Improving the power dissipation capability of the PCB design

2. Improving the thermal coupling of the component to the PCB by soldering all pins to traces as wide as

possible.

3. Introducing airflow in the system

is about 476 mW, as calculated in Equation 7. More power can be dissipated if the maximum ambient

temperature of the application is lower.

The package dimensions for this YFF package are shown in the table below. See the package drawing at the

end of this data sheet for more details.

YFF Package Dimensions

Packaged Devices

D

E

TPS63010YFF

2.14 ± 0.05 mm

1.93 ± 0.05 mm

22

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