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TLV320DAC3120IRHBR Datasheet(PDF) 4 Page - Texas Instruments

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Part # TLV320DAC3120IRHBR
Description  Low-Power Mono Audio DAC With Embedded miniDSP and Mono Class-D Speaker Amplifier
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TLV320DAC3120IRHBR Datasheet(HTML) 4 Page - Texas Instruments

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TLV320DAC3120
SLAS659 – NOVEMBER 2009
www.ti.com
TERMINAL FUNCTIONS (continued)
TERMINAL
I/O
DESCRIPTION
NAME
NO.
MICBIAS
12
O
Micophone bias voltage
NC
4, 15, 30
No connection
RESET
31
I
Device reset
SCL
10
I/O
I2C control-bus clock input
SDA
9
I/O
I2C control-bus data input
SPKM
19, 23
O
Class-D speaker driver inverting output
SPKP
22, 26
O
Class-D speaker driver noninverting output
SPKVDD
21, 24
Class-D speaker driver power supply
SPKVSS
20, 25
Class-D speaker driver power-supply ground
VOL/MICDET
11
I
Volume control or microphone/headphone/headset detection
WCLK
6
I/O
Audio serial word clock
3
ELECTRICAL SPECIFICATIONS
3.1
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
UNIT
AVDD to AVSS
–0.3 to 3.9
V
DVDD to DVSS
–0.3 to 2.5
V
HPVDD to HPVSS
–0.3 to 3.9
V
SPKVDD to SPKVSS
–0.3 to 6
V
IOVDD to IOVSS
–0.3 to 3.9
V
Digital input voltage
IOVSS – 0.3 to IOVDD + 0.3
V
Analog input voltage
AVSS – 0.3 to AVDD + 0.3
V
Operating temperature range
–40 to 85
°C
Storage temperature range
–55 to 150
°C
Junction temperature (TJ Max)
105
°C
Power dissipation
(TJ Max – TA)/RθJA
W
QFN package
RθJA Thermal impedance (with thermal pad soldered to board)
35
°C/W
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Table 3-1. System Thermal Characteristics(1)
Power Rating at 25°C
Derating Factor
Power Rating at 70°C
Power Rating at 85°C
2.3 W
28.57 mW/°C
1 W
0.6 W
(1)
This data was taken using 2-oz. (0.071-mm thick) trace and copper pad that is soldered to a JEDEC high-K, standard 4-layer
3-in. × 3-in. (7.62-cm × 7.62-cm) PCB.
4
ELECTRICAL SPECIFICATIONS
Copyright © 2009, Texas Instruments Incorporated
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Product Folder Link(s): TLV320DAC3120


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