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74HCT4067DB Datasheet(PDF) 2 Page - NXP Semiconductors

Part No. 74HCT4067DB
Description  16-channel analog multiplexer/demultiplexer
Download  29 Pages
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Maker  NXP [NXP Semiconductors]
Homepage  http://www.nxp.com
Logo NXP - NXP Semiconductors

74HCT4067DB Datasheet(HTML) 2 Page - NXP Semiconductors

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74HC_HCT4067_3
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 — 15 October 2007
2 of 29
NXP Semiconductors
74HC4067; 74HCT4067
16-channel analog multiplexer/demultiplexer
4.
Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74HC4067
74HC4067N
−40 °C to +125 °C
DIP24
plastic dual in-line package; 24 leads (600 mil);
reverse bending
SOT101-1
74HC4067D
−40 °C to +125 °C
SO24
plastic small outline package; 24 leads;
body width 7.5 mm
SOT137-1
74HC4067DB
−40 °C to +125 °C
SSOP24
plastic shrink small outline package; 24 leads;
body width 5.3 mm
SOT340-1
74HC4067PW
−40 °C to +125 °C
TSSOP24
plastic thin shrink small outline package; 24 leads;
body width 4.4 mm
SOT355-1
74HC4067BQ
−40 °C to +125 °C
DHVQFN24 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 24 terminals;
body 3.5
× 5.5 × 0.85 mm
SOT815-1
74HCT4067
74HCT4067N
−40 °C to +125 °C
DIP24
plastic dual in-line package; 24 leads (600 mil);
reverse bending
SOT101-1
74HCT4067D
−40 °C to +125 °C
SO24
plastic small outline package; 24 leads;
body width 7.5 mm
SOT137-1
74HCT4067DB
−40 °C to +125 °C
SSOP24
plastic shrink small outline package; 24 leads;
body width 5.3 mm
SOT340-1
74HCT4067PW
−40 °C to +125 °C
TSSOP24
plastic thin shrink small outline package; 24 leads;
body width 4.4 mm
SOT355-1
74HCT4067BQ
−40 °C to +125 °C
DHVQFN24 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 24 terminals;
body 3.5
× 5.5 × 0.85 mm
SOT815-1


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