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74HC366 Datasheet(PDF) 1 Page - NXP Semiconductors

Part No. 74HC366
Description  Hex buffer/line driver; 3-state; inverting
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Maker  NXP [NXP Semiconductors]
Homepage  http://www.nxp.com
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74HC366 Datasheet(HTML) 1 Page - NXP Semiconductors

 
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1.
General description
The 74HC366; 74HCT366 is a high-speed Si-gate CMOS device and is pin compatible
with Low-power Schottky TTL (LSTTL).
The 74HC366; 74HCT366 has six inverting buffer/line drivers with 3-state outputs. The
3-state outputs (nY) are controlled by the output enable inputs (OE1, OE2). A HIGH on
OEn causes the outputs to assume a high-impedance OFF-state.
The 74HC366; 74HCT366 is functionally identical to:
74HC365; 74HCT365, but has inverted outputs
2.
Features
I Inverting outputs
I Complies with JEDEC standard no. 7A
I ESD protection:
N HBM EIA/JESD22-A114-D exceeds 2000 V
N MM EIA/JESD22-A115-A exceeds 200 V
I Specified from −40 °Cto+85 °C and from −40 °C to +125 °C
3.
Ordering information
74HC366; 74HCT366
Hex buffer/line driver; 3-state; inverting
Rev. 03 — 21 November 2006
Product data sheet
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
74HC366
74HC366D
−40 °C to +125 °C
SO16
plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
74HC366N
−40 °C to +125 °C
DIP16
plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
74HC366PW
−40 °C to +125 °C
TSSOP16
plastic thin shrink small outline package; 16 leads; body
width 4.4 mm
SOT403-1
74HCT366
74HCT366D
−40 °C to +125 °C
SO16
plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
74HCT366DB
−40 °C to +125 °C
SSOP16
plastic shrink small outline package; 16 leads; body width
5.3 mm
SOT338-1
74HCT366N
−40 °C to +125 °C
DIP16
plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
74HCT366PW
−40 °C to +125 °C
TSSOP16
plastic thin shrink small outline package; 16 leads; body
width 4.4 mm
SOT403-1


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