6

SJ SERIES

1. General Information

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Relaysproducedafterthespecificdatecodethatisindicatedoneachdatasheetarelead-free

now.Mostofoursignalandpowerrelaysarelead-free.PleaserefertoLead-FreeStatusInfo.

(http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf)

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LeadfreesolderpastecurrentlyusedinrelaysisSn-3.0Ag-0.5Cu.

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AllsignalandmostpowerrelaysalsocomplywithRoHS.Pleaserefertoindividualdata

sheets.RelaysthatareRoHScompliantdonotcontainthe5hazardousmaterialsthat

arerestrictedbyRoHSdirective(lead,mercury,chromiumIV,PBB,PBDE).

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Ithasbeenverifiedthatusinglead-freerelaysinleadedassemblyprocesswillnotcauseany

problems(compatible).

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“LF”ismarkedoneachouterandinnercarton.(Nomarkingonindividualrelays).

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Toavoidleadedrelays(forlead-freesample,etc.)pleaseconsultwithareasalesoffice.

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Wewillshipleadedrelaysaslongastheleadedrelayinventoryexists.

Note:CadmiumwasexemptedfromRoHSonOctober21,2005.(AmendmenttoDirective2002/95/EC)

2. Recommended Lead Free Solder Profile

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RecommendedsolderpasteSn-3.0Ag-0.5Cu.

RoHS Compliance and Lead Free Relay Information

Reflow Solder condition

3. Moisture Sensitivity

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MoistureSensitivityLevelstandardisnotapplicabletoelectromechanicalrealys.

4. Tin Whisker

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DippedSnAgCusolderisknownaslowrisktinwhisker.Noconsiderablelengthwhiskerwasfoundbyourin

housetest.

We highly recommend that you confirm your actual solder conditions

Flow Solder condition:

Pre-heating:

maximum120˚C

Soldering:

dipwithin5sec.at

260˚Csolerbath

Solder by Soldering Iron:

SolderingIron

Temperature: maximum360˚C

Duration:

maximum3sec.