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CL-L102-MC3 Datasheet(PDF) 3 Page - CITIZEN ELECTRONICS CO., LTD. |
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CL-L102-MC3 Datasheet(HTML) 3 Page - CITIZEN ELECTRONICS CO., LTD. |
3 / 1 page R ef.CE-P471 04/09 4. Simulation Simulation is one of the effective means for thermal design. Fig. 4 (a) and (b) indicate the simulation results under the following conditions where the CL-L102-C3 package is connected to a heat sink using a thermal conductive sheet. Use them for reference. · Boundary conditions Ambient temperature: Ta = 25°C Thermal conductivity: 5 W/m ·K Heat release coefficient of the heat sink: 0.2 Connection resistance: Out of consideration · Model conditions Thermal conductivity of the thermal conductive sheet: 1.2 W/m ·K Thickness of the thermal conductive sheet: t = 0.12 mm Material of the heat sink: Aluminum Dimensions: 31.5 mm W x 12 mm H x L mm (variable) Fig. 4 (a) Fig. 4 (b) |
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