7

FTR-K1 SERIES

FTR-C2 SERIES

1. General Information

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��llsi�nalandp�werrelayspr�d�cedbyF�jits�C�mp�nentsarec�mpliantwit�R�HSdirective2002/95EC

incl�din�amendments.

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Cadmi�mas�sedinelectricalc�ntactsisexemptedfr�mt�eR�HSdirectives�nOct�ber2st,2005.

(��mendmentt�Directive2002/95/EC)

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��ll�f��rsi�nalandp�werrelaysarelead-free.Pleaserefert�Lead-FreeStat�sInf�f�r�lderdatec�des

at:�ttp://www.f�jits�.c�m/�s/d�wnl�ads/MICRO/fcai/relays/lead-free-letter.pdf

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Lead free solder plating on relay terminals is Sn-3.0Ag-0.5Cu, unless otherwise specified.

This material has been verified to be compatible with PbSn assembly process.

2. Recommended Lead Free Solder Profile

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Rec�mmendeds�lderSn-3.0���-0.5C�.

RoHS Compliance and Lead Free Information

3. Moisture Sensitivity

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M�ist�reSensitivityLevelstandardisn�tapplicablet�electr�mec�anicalrelays,�nless�t�erwiseindicated.

4. Tin Whiskers

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DippedSn���C�s�lderiskn�wnaspresentin�al�wriskt�tinw�iskerdevel�pment.N�c�nsiderablelen�t�

w�iskerwasf��ndby��rin���setest.

We highly recommend that you confirm your actual solder conditions

Flow Solder condition:

Pre-heating:

maximum 120˚C

S�lderin�:

dipwit�in5sec.at

260˚C solder bath

Solder by Soldering Iron:

S�lderin�Ir�n

Temperature: maximum 360˚C

D�rati�n:

maxim�m3sec.

REFLOW

N�te:

1.Temperature profiles show the

temperat�re�fPCb�ards�rface.

2.Pleaseperf�rms�lderin�testwit�y��r

act�alPCb�ardbef�remasspr�d�cti�n,

sincet�etemperat�res�fPC

b�ards�rfacescanvary,dependin��nt�e

size�fPCb�ard,stat�s�fparts

m��ntin�and�eatin�met��d.