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AD9148-M5375-EBZ Datasheet(PDF) 9 Page - Analog Devices |
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AD9148-M5375-EBZ Datasheet(HTML) 9 Page - Analog Devices |
9 / 73 page Preliminary Technical Data AD9148 Rev. PrA | Page 9 of 73 Table 8. Thermal Resistance and Maximum Power Package Type PCB Maximum Power (W) TA (°C) PCB Layers PCB Vias External Heatsink1 Case TJ (°C) θJA (°C/W) 196-ball CSP_BGA 85 12 25 No CSP_BGA 125 18.0 2.22 196-ball CSP_BGA 85 12 25 Yes CSP_BGA 125 16.0 2.50 196-ball BGA_EP 85 12 25 No BGA_EP 125 15.0 2.67 196-ball BGA_EP 85 12 25 Yes BGA_EP 125 14.0 2.86 1 Heat sink is used in the thermal model: 13 mm × 13 mm, 15 mm tall. Table 9. Power vs. fDAC Rate and Functionality Maximum fDAC (MSPS)1 Coarse Modulation Fine Modulation (NCO) Maximum Power (W) Package Heat-Sink Combination2 PLL Off PLL On PLL Off PLL On 2.22 CSP_BGA No 820 740 695 630 2.50 CSP_BGA Yes 950 875 810 740 2.67 BGA_EP No 1000 945 870 810 2.86 BGA_EP Yes 1000 1000 940 870 1 Typical maximum fDAC rate with inverse sinc filter off. 2 Heat sink is used in the thermal model: 13 mm × 13 mm, 15 mm tall. |
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