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SS8046TH1TB Datasheet(PDF) 6 Page - Silicon Standard Corp. |
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SS8046TH1TB Datasheet(HTML) 6 Page - Silicon Standard Corp. |
6 / 7 page www.SiliconStandard.com 6 of 7 Rev.2.01 6/06/2003 SS8046 Package Outlines TO 220F-4 Package (short lead) Note: 1. Lead frame material: TAMAC-4 2. Solder plating thickness: 10 ±5µm 3. Package body size include mold flash and gate burr 4. Tolerance ±0.1mm unless otherwise specified 5. End flash Max. 0.05mm 6. Mismatch Max. 0.05mm 7. Misalignment Max. 0.05mm 8. Epoxy molding compound: SUMITOMO 6300H or equivalent 9. Matte finish Ra: 0.2µm~0.8µm top and bottom surface DIMENSION IN MM DIMENSION IN INCH SYMBOL MIN. NOM. MAX. MIN. NOM. MAX. A 4.42 4.57 4.72 0.174 0.180 0.186 A1 2.69 2.79 2.89 0.106 0.110 0.114 A2 1.68 1.78 1.88 0.066 0.070 0.074 D 10.00 10.10 10.20 0.400 0.404 0.408 E 6.25 6.35 6.45 0.246 0.250 0.254 E1 8.54 8.64 8.74 0.336 0.340 0.344 C ----- 0.48 ----- ----- 0.019 ----- e ----- 2.54(TYP) ----- ----- 0.1(TYP) ----- b ----- 0.635(TYP) ----- ----- 0.025(TYP) ----- ? 4 ° 7 ° 11 ° 4 ° 7 ° 11 ° D E b E1 2.8 ± 0.15 e A A1 C A2 4.8 3.75 D E b E1 2.8 ± 0.15 e A A1 C A2 4.8 3.75 |
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