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SG2626DW Datasheet(PDF) 2 Page - Microsemi Corporation |
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SG2626DW Datasheet(HTML) 2 Page - Microsemi Corporation |
2 / 8 page Rev 1.1a Copyright © 1994 11861 Western Avenue ∞ ∞ ∞ ∞ ∞ Garden Grove, CA 92841 2 (714) 898-8121 ∞ ∞ ∞ ∞ ∞ FAX: (714) 893-2570 SG1626/SG2626/SG3626 ABSOLUTE MAXIMUM RATINGS (Note 1) Supply Voltage (V CC) ........................................................... Logic Input Voltage ............................................................... Source/Sink Output Current (Each Output) Continuous ................................................................... Pulse, 500ns ................................................................ 22V 7V ±0.5A ±3.0A Operating Junction Temperature Hermetic (J, T, Y, R-Packages) ................................... Plastic (M, DW, L-Packages) ....................................... Storage Temperature Range ............................ Lead Temperature (Soldering, 10 Seconds) ................... 150 °C 150 °C -65 °C to 150°C 300 °C Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect to ground. All currents are positive into the specified terminal. THERMAL DATA J Package: Thermal Resistance-Junction to Case, θ JC .................. 30°C/W Thermal Resistance-Junction to Ambient, θ JA .............. 80°C/W Y Package: Thermal Resistance-Junction to Case, θ JC .................. 50°C/W Thermal Resistance-Junction to Ambient, θ JA ............ 130°C/W M Package: Thermal Resistance-Junction to Case, θ JC .................. 60°C/W Thermal Resistance-Junction to Ambient, θ JA ............. 95°C/W DW Package: Thermal Resistance-Junction to Case, θ JC .................. 40°C/W Thermal Resistance-Junction to Ambient, θ JA .............. 95°C/W T Package: Thermal Resistance-Junction to Case, θ JC .................. 25°C/W Thermal Resistance-Junction to Ambient, θ JA ........... 130°C/W R Package: Thermal Resistance-Junction to Case, θ JC ................. 5.0°C/W Thermal Resistance-Junction to Ambient, θ JA ............. 40°C/W L Package: Thermal Resistance-Junction to Case, θ JC .................. 35°C/W Thermal Resistance-Junction to Ambient, θ JA ........... 120°C/W Note A. Junction Temperature Calculation: T J = T A + (P D x θ JA ). Note B. The above numbers for θ JC are maximums for the limiting thermal resistance of the package in a standard mount- ing configuration. The θ JA numbers are meant to be guidelines for the thermal performance of the device/pc- board system. All of the above assume no ambient airflow. V IN = 2.4V V IN = 5.5V V IN = 0V I IN = -10mA I OUT = -200mA I OUT = 200mA V IN = 2.4V (both inputs) V IN = 0V (both inputs) Logic 1 Input Voltage Logic 0 Input Voltage Input High Current Input High Current Input Low Current Input Clamp Voltage Output High Voltage (Note 4) Output Low Voltage (Note 4) Supply Current Outputs Low Supply Current Outputs High 0.7 500 1.0 -4 -1.5 1.0 27 12 V V µA mA mA V V V mA mA 2.0 V CC-3 18 7.5 -55 °C to 125°C -25 °C to 85°C 0 °C to 70°C Note 2. Range over which the device is functional. Note 3. AC performance has been optimized for V CC = 8V to 20V. Supply Voltage (V CC) .................................. Frequency Range ............................................... Peak Pulse Current ............................................................ Logic Input Voltage ................................................ 4.5V to 20V (Note 3) DC to 1.5MHz ±3A -0.5 to 5.5V Operating Ambient Temperature Range (T J) SG1626 ......................................................... SG2626 ........................................................... SG3626 .............................................................. RECOMMENDED OPERATING CONDITIONS (Note 2) ELECTRICAL CHARACTERISTICS (Unless otherwise specified, these specfiications apply over the operating ambient temperatures for SG1626 with -55 °C ≤ T A ≤ 125°C, SG2626 with - 25 °C ≤ T A ≤ 85°C, SG3626 with 0°C ≤ TA ≤ 70°C, and VCC = 20V. Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.) Test Conditions Parameter Static Characteristics Units SG1626/2626/3626 Min. Typ. Max. Note 4. V CC = 10V to 20V. RoHS Peak Package Solder Reflow Temp. (40 sec. max. exp.)...... 260°C (+0, -5) |
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