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SG2525ADW Datasheet(PDF) 2 Page - Microsemi Corporation

Part # SG2525ADW
Description  REGULATING PULSE WIDTH MODULATOR
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Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

SG2525ADW Datasheet(HTML) 2 Page - Microsemi Corporation

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Rev 1.4a
Copyright
© 1996
11861 Western Avenue
∞ Garden Grove, CA 92841
2
(714) 898-8121
∞ FAX: (714) 893-2570
Oscillator Charging Current ............................................
Operating Junction Temperature Range
Hermetic (J, L Packages) .....................................
Plastic (N, DW Packages ) .......................................
Storage Temperature Range ..........................
Lead Temperature (Soldering, 10 seconds) .................
Supply Voltage (+V
IN) .......................................................
Collector Supply Voltage (V
C) ...........................................
Logic Inputs .......................................................
Analog Inputs .......................................................
Output Current, Source or Sink ...................................
Reference Load Current ...............................................
40V
40V
-0.3V to 5.5V
-0.3V to V
IN
500mA
50mA
5mA
150
°C
150
°C
-65
°C to 150°C
300
°C
ABSOLUTE MAXIMUM RATINGS (Note 1)
Note 1. Values beyond which damage may occur.
Input Voltage (+V
IN) ................................................
Collector Voltage (V
C) ..........................................
Sink/Source Load Current (steady state) .............
Sink/Source Load Current (peak) .........................
Reference Load Current ........................................
Oscillator Frequency Range .......................
Oscillator Timing Resistor (R
T) ........................
8V to 35V
4.5V to 35V
0 to 100mA
0 to 400mA
0 to 20mA
100Hz to 350KHz
2K
Ω to 150KΩ
Deadtime Resistor Range (R
D) .............................
Maximum Shutdown Source Impedance .........................
Oscillator Timing Capacitor (C
T) ...................
Operating Ambient Temperature Range
SG1525A/SG1527A ....................................
SG2525A/SG2527A ......................................
SG3525A/SG3527A .........................................
0
Ω to 500Ω
5K
0.001
µF to 0.1µF
-55
°C to 125°C
-25
°C to 85°C
0
°C to 70°C
Note 2: Range over which the device is functional.
RECOMMENDED OPERATING CONDITIONS (Note 2)
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG1525A/SG1527A with -55
°C ≤ T
A
125
°C,
SG2525A/SG2527A with -25
°C ≤ T
A ≤ 85°C, SG3525A/SG3527A with 0°C ≤ TA ≤ 70°C, and +VIN = 20V. Low duty cycle pulse testing techniques are
used which maintains junction and case temperatures equal to the ambient temperature.)
5.05
5.00
Reference Section
T
J = 25°C
V
IN = 8V to 35V
I
L = 0 to 20mA
Over Operating Temperature Range
Over Line, Load and Temperature
V
REF = 0V, TJ = 25°C
10Hz
≤ f ≤ 10KHz, T
J = 25°C
T
J = 125°C
Output Voltage
Line Regulation
Load Regulation
Temperature Stability (Note 3)
Total Output Voltage Range (Note 3)
Short Circuit Current
Output Noise Voltage (Note 3)
Long Term Stability (Note 3)
Min. Typ. Max. Min. Typ. Max.
Note 3. These parameters, although guaranteed over the recommended operating conditions, are not 100% tested in production.
Note 4. F
OSC = 40KHz (RT = 3.6KΩ, CT = 0.01µF, RD = 0Ω)
Note 5. Applies to SG1525A/2525A/3525A only, due to polarity of output pulses.
SG3525A
SG3527A
SG1525A/2525A
SG1527A/2527A
Units
Test Conditions
Parameter
V
mV
mV
mV
V
mA
µVrms
mV/khr
5.20
30
50
50
5.25
100
200
50
5.10
10
20
20
80
40
20
5.00
4.95
5.15
30
50
50
5.20
100
200
50
5.10
10
20
20
80
40
20
THERMAL DATA
J Package:
Thermal Resistance-Junction to Case,
θ
JC ..................
30°C/W
Thermal Resistance-Junction to Ambient,
θ
JA .............. 80°C/W
DW Package:
Thermal Resistance-Junction to Case,
θ
JC ..................
40°C/W
Thermal Resistance-Junction to Ambient,
θ
JA .............
95°C/W
L Package:
Thermal Resistance-Junction to Case,
θ
JC ..................
35°C/W
Thermal Resistance-Junction to Ambient,
θ
JA ...........
120°C/W
N Package:
Thermal Resistance-Junction to Case,
θ
JC ................... 40°C/W
Thermal Resistance-Junction to Ambient,
θ
JA .............
65°C/W
Note A. Junction Temperature Calculation: T
J = TA + (PD x θJA).
Note B. The above numbers for
θ
JC are maximums for the limiting
thermal resistance of the package in a standard mount-
ing configuration. The
θ
JA numbers are meant to be
guidelines for the thermal performance of the device/pc-
board system. All of the above assume no ambient
airflow.
RoHS Peak Package Solder Reflow Temp. (40 sec. max. exp.)...... 260°C(+0, -5)


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