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SG237AK Datasheet(PDF) 2 Page - Microsemi Corporation |
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SG237AK Datasheet(HTML) 2 Page - Microsemi Corporation |
2 / 6 page SG137A/SG137 SERIES 2/92 Rev 1.1 2/94 LINFINITY Microelectronics Inc. Copyright © 1994 11861 Western Avenue ∞ ∞ ∞ ∞ ∞ Garden Grove, CA 92841 2 (714) 898-8121 ∞ ∞ ∞ ∞ ∞ FAX: (714) 893-2570 Power Dissipation .......................................... Input to Output Voltage Differential .................................... Storage Temperature Range ............................ ABSOLUTE MAXIMUM RATINGS (Note 1) Internally Limited 40V -65 °C to 150°C Operating Junction Temperature Hermetic (K, R, T, L, IG-Packages) ........................... Lead Temperature (Soldering, 10 Seconds) ............. 150 °C 300 °C Note 1. Exceeding these ratings could cause damage to the device. RECOMMENDED OPERATING CONDITIONS (Note 2 & 3) Input Voltage Range ..............................-(V OUT + 3.5V) to -36V Operating Junction Temperature Range SG137A/SG137 ............................................ SG237A/SG237 ............................................ SG337A/SG337 ............................................. -55°C to 150°C -25°C to 150°C 0°C to 125°C Note 2. Range over which the device is functional. Note 3. These ratings are applicable for junction temperatures of less than 135°C. ELECTRICAL CHARACTERISTICS (Unless otherwise specified, these specifications apply over full operating ambient temperatures for SG137A/SG137 with -55°C ≤ T A ≤ 150°C, SG237A/ SG237 with -25°C ≤ T A ≤ 150°C, SG337A/SG337 with 0°C ≤ T A ≤ 125°C, |V IN - V OUT | = 5.0V, and for I OUT = 500mA (K, R, and IG power packages) and I OUT = 100mA (T and L packages). Although power dissipation is internally limited, these specifications are applicable for power dissipations of 2 Ωfor the T and L packages, and 20 Ω for the K, R, and IG packages. I MAX is 1.5A for the K, R, and IG packages and 0.5A for the T and L packages. Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.) THERMAL DATA K Package: Thermal Resistance-Junction to Leads, θ JC ................ 3.0°C/W Thermal Resistance-Junction to Ambient, θ JA ............... 35°C/W R Package: Thermal Resistance-Junction to Leads, θ JC ................ 5.0°C/W Thermal Resistance-Junction to Ambient, θ JA .............. 40°C/W T Package: Thermal Resistance-Junction to Leads, θ JC ................. 15°C/W Thermal Resistance-Junction to Ambient, θ JA ............ 120°C/W IG Package: Thermal Resistance-Junction to Leads, θ JC ................ 3.5°C/W Thermal Resistance-Junction to Ambient, θ JA .............. 42°C/W L Package: Thermal Resistance-Junction to Leads, θ JC ................. 35°C/W Thermal Resistance-Junction to Ambient, θ JA ............ 120°C/W Units SG137/SG237 Min. Typ. Max. Min. Typ. Max. SG137A/SG237A Parameter Test Conditions I OUT = 10mA, T A = 25°C 3V ≤ |V IN - VOUT| ≤ 40V, 10mA ≤ IOUT ≤ IMAX 3V ≤ |V IN - VOUT| ≤ 40V, I OUT ≤ IMAX T A = 25°C 10mA ≤ I OUT ≤ IMAX |V OUT| ≤ 5V, TA = 25°C |V OUT| ≥ 5V, T A = 25°C |V OUT| ≤ 5V |V OUT| ≥ 5V T A = 25°C, 10ms pulse V OUT = -10V, f =120Hz C ADJ = 0, TA = 25°C C ADJ = 10µF T A = 25°C 3V ≤ |V IN - V OUT| ≤ 40V 10mA ≤ I OUT ≤ IMAX Reference Voltage (Note 6) Line Regulation (Note 4, 6) Load Regulation (Note 4) Thermal Regulation (Note 5) Ripple Rejection Adjust Pin Current Adjust Pin Current Change (Note 6) -1.238 -1.220 60 70 -1.250 -1.250 0.005 5 0.1 10 0.2 0.002 66 80 65 1.0 0.2 -1.262 -1.280 0.01 25 0.5 50 1.0 0.02 100 5 2 -1.225 -1.200 66 -1.250 -1.250 0.01 15 0.3 20 0.3 0.002 60 77 65 2 0.5 -1.275 -1.300 0.02 25 0.5 50 1.0 0.02 100 5 5 V V %/V mV % mV % %/W dB dB µA µA µA Note A. Junction Temperature Calculation: T J = TA + (PD x θJA). Note B. The above numbers for θ JC are maximums for the limiting thermal resistance of the package in a standard mount- ing configuration. The θ JA numbers are meant to be guidelines for the thermal performance of the device/pc- board system. All of the above assume no ambient airflow. |
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