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LX8213-33ISE Datasheet(PDF) 10 Page - Microsemi Corporation |
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LX8213-33ISE Datasheet(HTML) 10 Page - Microsemi Corporation |
10 / 11 page LX8213 PRODUCTION DATASHEET Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 10 Copyright © 2009 Rev. 1.1, 2009-03-24 300mA Low Noise CMOS LDO Regulator TM ® APPLICA T ION IN F O RM ATION Description The LX8213 is a family of CMOS based LDO (Low Drop-Out) regulators in a small 5 pin SOT-23 package that provides a compact and cost effective solution. The LX8213 is offered with fixed output voltages of 1.2V or 3.3V, in addition to an adjustable version with an output voltage range of 1.2V to 5.5V. The LX8213 features low power consumption over a wide supply voltage range, high output voltage accuracy, low dropout, excellent line and load regulation, fast transient response, and low noise. Please refer to the Electrical Characteristics Table for the specifications. Input Capacitor To improve load transient response and noise rejection, an input bypass capacitor is recommended, but it is not required for stability. There are no requirements for the ESR (Equivalent Series Resistor) on the input capacitor, but tolerance and temperature coefficient must be considered when selecting the capacitor to ensure the capacitor will be around 1µF over the entire operating temperature range. Capacitors with X5R or X7R characteristics are recommended. Output Capacitor For stability of the regulator, use a minimum 1uF capacitor to bypass from VOUT to GND. Note that the LX8213 is stable using low ESR ceramic capacitors. Capacitors with X5R or X7R characteristics generally perform well and are recommended. Adjustable Output Voltage The LX8213-00 output voltage can be set within the range of 1.2V to 5.5V by connecting the FB pin to an external resistor divider (See Figure 3). The output voltage can be calculated using: ⎥⎦ ⎤ ⎢⎣ ⎡ + = R2 R1 1 0.8 V OUT R2 is chosen to minimize the power dissipated by the resistor divider network while providing enough FB input bias current. A value of 8.06kΩ is recommended. Shutdown ( SHDN ) The LX8213 includes an active low shutdown input ( SHDN ). When the SHDN pin is left floating, an internal pull down resistor to GND of 3MΩ will automatically disable the device. Upon shutdown, an internal MOSFET connected from VOUT to GND will be turned ON to discharge the output capacitor. To enable the regulator, set SHDN to logic high. If shutdown capability is not required, connect SHDN pin to VIN. For specification on minimum and maximum logic high levels, please refer to the Electrical Characteristics Table. Foldback Current Limit The LX8213 uses a foldback current limit. When the load current exceeds approximately 400mA, the output voltage is reduced along with the output current, minimizing power dissipated and protecting the device from excessive heating. Short Circuit Current Protection Under conditions where the output of the LX8213 is shorted to ground, internal circuitry will limit the device to source only about 50mA. Temperature Protection The thermal protection shuts down the LX8213 when the junction temperature exceeds approximately 165°C, with a hysteresis of about 30˚C. Thermal Consideration Thermal shutdown protects the integrated circuit from thermal overload caused from a rise in junction temperature during power dissipation. This means the protection is intended for fault protection only and not as a means of current or power limiting during normal application usage. Proper thermal evaluation should be done to ensure that the junction temperature dose not exceed it’s maximum rating. Operating at the maximum TJ of 150°C can impact reliability. Due to variation in individual device electrical characteristics and thermal resistance, the built in thermal overload protection may be activated at power levels slightly above or below the rated dissipation. Power dissipation for regulator can be calculated using the following equation: PD = (VIN(MAX)-VOUT(MIN)) * IOUT(MAX) (Note: power dissipation resulting from quiescent current is negligible) For the SOT23 package, thermal resistance, θJA is 250°C/W when mounted on a FR4 copper clad PCB. Junction temperature of the integrated circuit can be calculated using: TJ = TA + TRISE, substituting: TA + (PD * θJA). An example: Given conditions: TA = 25°C, VIN= 2.5V, VOUT= 1.2V, IOUT= 200mA. Calculated values: Total Power dissipation PD(total) = (2.5-1.2) V * 0.2A =0.26W Junction Temperature TJ = 25°C +(0.26W *250°C/W) = 90°C |
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