H5MS1G22MFP-J3M datasheet(7/63 Pages) HYNIX

Part #	H5MS1G22MFP-J3M

Description	1Gbit MOBILE DDR SDRAM based on 8M x 4Bank x32 I/O

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Manufacturer	HYNIX [Hynix Semiconductor]

Direct Link	http://www.skhynix.com/kor/main.do

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7 / 63 page

Rev 1.2 / Jun. 2008

7

Mobile DDR SDRAM 1Gbit (32M x 32bit)

H5MS1G22MFP Series / H5MS1G32MFP Series

INFORMATION for Hynix KNOWN GOOD DIE

With the advent of Multi-Chip package (MCP), Package on Package (PoP) and System in a Package (SiP) applications,

customer demand for Known Good Die (KGD) has increased.

Requirements for smaller form factors and higher memory densities are fueling the need for Wafer-level memory solu-

tions due to their superior flexibility. Hynix Known Good Die (KGD) products can be used in packaging technologies

such as systems-in-a-package (SIP) and multi-chip package (MCP) to reduce the board area required, making them

ideal for hand-held PCs, and many other portable digital applications.

Hynix Mobile SDRAM will be able to continue its constant effort of enabling the advanced package products of all appli-

cation customers.

- Please Contact Hynix Office for Hynix KGD product availability and informations.

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