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H5DU2562GTR Datasheet(PDF) 24 Page - Hynix Semiconductor

Part No. H5DU2562GTR
Description  256Mb DDR SDRAM
Download  28 Pages
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Maker  HYNIX [Hynix Semiconductor]
Homepage  http://www.skhynix.com/kor/main.do
Logo HYNIX - Hynix Semiconductor

H5DU2562GTR Datasheet(HTML) 24 Page - Hynix Semiconductor

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Rev. 1.1 / Sep. 2009
24
H5DU2562GTR
H5DU2582GTR
20.tQH = tHP - tQHS, where:
tHP = minimum half clock period for any given cycle and is defined by clock high or clock low (tCH, tCL). tQHS accounts for 1) The
pulse duration distortion of on-chip clock circuits; and 2) The worst case push--out of DQS on one transition followed by the
worst case pull--in of DQ on the next transition, both of which are, separately, due to data pin skew and output pattern effects,
and p-channel to n-channel variation of the output drivers.
21. tDQSQ:
Consists of data pin skew and output pattern effects, and p-channel to n-channel variation of the output drivers for any given
cycle.
22. tDAL = (tWR/tCK) + (tRP/tCK)
For each of the terms above, if not already an integer, round to the next highest integer.
Example: For DDR266B at CL=2.5 and tCK=7.5 ns
tDAL = ((15 ns / 7.5 ns) + (20 ns / 7.5 ns)) clocks
= ((2) + (3)) clocks
= 5 clocks
23. In all circumstances, tXSNR can be satisfied using
tXSNR = tRFCmin + 1*tCK
24. The only time that the clock frequency is allowed to change is during self-refresh mode.
25. If refresh timing or tDS/tDH is violated, data corruption may occur and the data must be re-written with valid data before a valid
READ can be executed.


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