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SKY65080-70LF Datasheet(PDF) 6 Page - Skyworks Solutions Inc.

Part No. SKY65080-70LF
Description  1500-2500 MHz Low Noise Power Amplifier Driver
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Maker  SKYWORKS [Skyworks Solutions Inc.]
Homepage  http://www.skyworksinc.com
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SKY65080-70LF Datasheet(HTML) 6 Page - Skyworks Solutions Inc.

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PRELIMINARY DATA SHEET • SKY65080-70LF PA DRIVER
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
6
October 5, 2009 • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • 201042D
0.06
0.07
0.04
0.05
0.08
0.09
0.10
0.11
0.12
–10
–5
0
+5
+10
+15
+20
+25
Output Power (dBm)
1950 MHz
1850 MHz
1700 MHz
Figure 9. Operating Current vs Output Power Over Frequency
Evaluation Board Description
The Skyworks SKY65080-70LF Evaluation Board is used to test
the performance of the SKY65080-70LF PA driver. An assembly
drawing for the Evaluation Board is shown in Figure 10 and the
layer detail is provided in Figure 11.
Capacitors C7, C8, and C9 provide DC bias decoupling for VCC.
Pins 1 and 3 are the RF input and output signals, respectively.
External DC blocking is required on the input and output, but can
be implemented as part of the RF matching circuit. Pin 2 and the
package backside metal, pin 4, are ground pins that provide the
DC and RF ground, respectively.
Circuit Design Configurations
The following design considerations are general in nature and
must be followed regardless of final use or configuration.
1. Paths to ground should be made as short as possible.
2. The ground pad of the SKY65080-70LF power amplifier has
special electrical and thermal grounding requirements. This
pad is the main thermal conduit for heat dissipation. Since the
circuit board acts as the heat sink, it must shunt as much
heat as possible from the amplifier. As such, design the
connection to the ground pad to dissipate the maximum
wattage produced to the circuit board. Multiple vias to the
grounding layer are required.
NOTE: Junction temperature (Tj) of the device increases with a
poor connection to the slug and ground. This reduces the
lifetime of the device.
A suggested matching circuit is shown in Figure 12 with
component values for the SKY65080-70LF-11 package option
listed in Table 5. Component values for the SKY65080-70LF-21
package option are shown in Table 6.
Testing Procedure
Use the following procedure to set up the SKY65080-70LF
Evaluation Board for testing:
1. Connect a 5.0 V supply to VCC. If available, enable the current
limiting function of the power supply to 100 mA.
2. Connect a signal generator to the RF signal input port. Set it to
the desired RF frequency at a power level of –15 dBm or less
to the Evaluation Board but do NOT enable the RF signal.
3. Connect a spectrum analyzer to the RF signal output port.
4. Enable the power supply.
5. Enable the RF signal.
6. Take measurements.
CAUTION: If any of the output signals exceed the rated
maximum values, the SKY65080-70LF Evaluation
Board can be permanently damaged.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
The SKY65080-70LF is rated to Moisture Sensitivity Level 1
(MSL1) at 260 C. It can be used for lead or lead-free soldering.


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