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CLA4608-000 Datasheet(PDF) 6 Page - Skyworks Solutions Inc. |
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CLA4608-000 Datasheet(HTML) 6 Page - Skyworks Solutions Inc. |
6 / 12 page DATA SHEET • CLA SERIES DIODES Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 6 September 28, 2009 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200100I Ground Plane Solder or Epoxy Die Bond Microstrip Board TFG 0.006 in. Thick, Typical 0.020 in. Typ. 0.001 in. Gold Wire Bond, Typical 50 Ω Connector Figure 6. Diodes in 50 Ω Microstrip Circuit (Side View) Diode, Typical TFG Board 50 Ω Conductor 0.022 in., Typical Ground Return X1 X2 Figure 7. Diodes in 50 Ω Microstrip Circuit (Top View) 50 Ω 50 Ω Coil for Ground Return X1 X2 CJ RR CJ RP CJ RP Figure 8. Low-Level Equivalent Circuit |
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