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P1072-BD

Mechanical Drawing

Units: millimeters Bond pad dimensions are shown to center of bond pad.

Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold

Most DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF and Vd3,4 Bond Pads are 0.100 x 0.200 (0.004 x 0.008)

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip,

Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 7.123 mg

Bond Pad #1 (RF In)

Bond Pad #6 (Vg3A)

Bond Pad #11 (Vd4B)

Bond Pad #16 (Vg2B)

Bond Pad #2 (Vg1A)

Bond Pad #7 (Vd3A)

Bond Pad #12 (Vg4B)

Bond Pad #17 (Vd1B)

Bond Pad #18 (Vg1B)

Bond Pad #3 (Vd1A)

Bond Pad #13 (Vd3B)

Bond Pad #4 (Vg2A)

Bond Pad #5 (Vd2A)

Bond Pad #8 (Vg4A)

Bond Pad #9 (Vd4A)

Bond Pad #10 (RFout)

Bond Pad #14 (Vg3B)

Bond Pad #15 (Vd2B)

34.0-37.0 GHz GaAs MMIC

Power Amplifier

Bias Arrangement (See App Notes [1], [2] and [3])

Layout for reference only – It is recommended to bias output

stage from both sides.

Mimix Broadband, Inc., 10795 Rockley Rd., Houston,Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Characteristic Data and Specifications are subject to change without notice. ©2010 Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

February 2010 - Rev 16-Feb-10

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0.0

1.575

(0.062)

3.150

(0.124)

0.157

(0.006)

0.557

(0.022)

0.957

(0.038)

1.321

(0.052)

1.732

(0.068)

2.277

(0.090)

2.727

(0.107)

3.126

(0.123)

1.575

(0.062)

3.700

(0.146)

0.0

0.157

(0.006)

0.557

(0.022)

0.957

(0.038)

1.321

(0.052)

1.732

(0.068)

2.277

(0.090)

2.727

(0.107)

3.126

(0.123)

Vg2

RF In

RF Out

Vg3 Vd3 Vg4 Vd4

Vg1

Vd1

Vd2

Vd3 Vg4 Vd4

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XP1072-BD

XP1072-BD