CYStech Electronics Corp.

Spec. No. : C474LB

Issued Date : 2009.08.13

Revised Date :

Page No. : 3/3

SB120 thru SB160

CYStek Product Specification

DO-204AL(DO-41) Dimension

DO-204AL(DO-41) Molded Plastic Package

CYStek Package Code: LB

DIM

Inches

Millimeters

Inches

Millimeters

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

ϕ0.0280 ϕ0.0339

ϕ0.71

ϕ0.86

D

1.0000

-

25.40

-

B

1.0000

-

25.40

-

E

ϕ0.0787 ϕ0.1063

ϕ2.00

ϕ2.70

C

0.1654

0.2047

4.20

5.20

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material :

• Lead : Axial leads, solderable per MIL-STD-202, Method 208 guaranteed.

• Mold Compound : Epoxy resin family, flammability solid burning class: UL94V-0

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.