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AS5304 Datasheet(PDF) 5 Page - ams AG
AMSCO [ams AG]
AS5304 Datasheet(HTML) 5 Page - ams AG
/ 13 page
AS5304/AS5306 Integrated Hall IC for linear and off-axis rotary motion detection
Page 5 of 13
7 Incremental Quadrature AB Output
The digital output is compatible to optical incremental
encoder outputs. Direction of rotation is encoded into
two signals A and B that are phase-shifted by 90º.
Depending on the direction of rotation, A leads B
(CW) or B leads A (CCW).
A single index pulse is generated once for every pole
pair. One pole pair is interpolated to 40 quadrature
pulses (160 steps), so one index pulse is generated
after every 40 quadrature pulses (see Figure 6)
The Index output is switched to Index = high, when a
magnet is placed over the Hall array as shown in
Figure 7, top graph: the north pole of the magnet is
placed over the left side of the IC (top view, pin#1 at
bottom left) and the south pole is placed over the
right side of the IC.
The index output will switch back to Index = low,
when the magnet is moved by one LSB from position
X=0 to X=X1, as shown in Figure 7, bottom graph.
One LSB is 25µm for AS5304 and 15µm for AS5306.
Note: Since the small step size of 1 LSB is hardly
recognizable in a correctly scaled graph it is shown as an
exaggerated step in the bottom graph of Figure 7.
Quadrature A / B and Index output
Magnetic Field Warning Indicator
The AS5304 can also provide a low magnetic field warning to indicate a missing magnet or when the end of the magnetic strip
has been reached. This condition is indicated by using a combination of A, B and Index, that does not occur in normal
A low magnetic field is indicated with:
Index = high
Vertical Distance between Magnet and IC
The recommended vertical distance between magnet and IC depends on the strength of the magnet and the length of the
Typically, the vertical distance between magnet and chip surface should not exceed ½ of the pole length.
That means for AS5304, having a pole length of 2.0mm, the maximum vertical gap should be 1.0mm,
For the AS5306, having a pole length of 1.2mm, the maximum vertical gap should be 0.6mm
These figures refer to the chip surface. Given a typical distance of 0.2mm between chip surface and IC package surface,
the recommended vertical distances between magnet and IC surface are therefore:
AS 5304: ≤ 0.8mm
AS 5306: ≤ 0.4mm
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