SE97 datasheet(46/55 Pages) NXP

Part #	SE97

Description	DDR memory module temp sensor with integrated SPD, 3.3 V

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Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

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46 / 55 page

SE97_7

Product data sheet

Rev. 07 — 29 January 2010

46 of 55

NXP Semiconductors

SE97

DDR memory module temp sensor with integrated SPD, 3.3 V

Fig 42. Package outline SOT908-1 (HVSON8)

0.5

0.2

1

0.05

0.00

A1

Eh

b

UNIT

D(1)

y

e

1.5

e1

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

3.1

2.9

cDh

1.65

1.35

y1

3.1

2.9

2.25

1.95

0.3

0.2

0.05

0.1

DIMENSIONS (mm are the original dimensions)

SOT908-1

MO-229

E(1)

0.5

0.3

L

0.1

v

0.05

w

SOT908-1

HVSON8: plastic thermal enhanced very thin small outline package; no leads;

8 terminals; body 3 x 3 x 0.85 mm

A(1)

max.

05-09-26

05-10-05

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

X

terminal 1

index area

B

A

D

E

detail X

A

A1

c

C

y

C

y1

exposed tie bar (4

×)

exposed tie bar (4

×)

b

terminal 1

index area

e1

e

A

C

B

v M

C

w M

Eh

Dh

L

14

5

8

0

1

2 mm

scale

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SE97 Datasheet(PDF) 46 Page - NXP Semiconductors

SE97 Datasheet(HTML) 46 Page - NXP Semiconductors

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