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SE97 Datasheet(PDF) 46 Page - NXP Semiconductors |
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SE97 Datasheet(HTML) 46 Page - NXP Semiconductors |
46 / 55 page SE97_7 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 07 — 29 January 2010 46 of 55 NXP Semiconductors SE97 DDR memory module temp sensor with integrated SPD, 3.3 V Fig 42. Package outline SOT908-1 (HVSON8) 0.5 0.2 1 0.05 0.00 A1 Eh b UNIT D(1) y e 1.5 e1 REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 3.1 2.9 cDh 1.65 1.35 y1 3.1 2.9 2.25 1.95 0.3 0.2 0.05 0.1 DIMENSIONS (mm are the original dimensions) SOT908-1 MO-229 E(1) 0.5 0.3 L 0.1 v 0.05 w SOT908-1 HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 x 3 x 0.85 mm A(1) max. 05-09-26 05-10-05 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. X terminal 1 index area B A D E detail X A A1 c C y C y1 exposed tie bar (4 ×) exposed tie bar (4 ×) b terminal 1 index area e1 e A C B v M C w M Eh Dh L 14 5 8 0 1 2 mm scale |
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