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CC45328R2KL Datasheet(PDF) 1 Page - ABC Taiwan Electronics Corp

Part # CC45328R2KL
Description  WOUND CHIP INDUCTOR
Download  8 Pages
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Manufacturer  ABC [ABC Taiwan Electronics Corp]
Direct Link  http://www.atec-group.com
Logo ABC - ABC Taiwan Electronics Corp

CC45328R2KL Datasheet(HTML) 1 Page - ABC Taiwan Electronics Corp

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background image
Reflow Area
6 0~1 50sec
2 0~40sec
（ PCB Pattern ）
CC4532□□□□L□-□□□
c﹒Terminal：Cu/Sn
d﹒Encapsulate：Epoxy novolac
h﹒Resistance to solvent：Per MIL-STD-202F
g﹒Resistance to solder heat：260℃.10 secs.
f﹒Rated current：Current cause
e﹒Terminal pull strength：1.5 kg min.
a﹒Temp. rise ：20℃ max.
b﹒Ambient temp.：100℃ max.
c﹒Storage temp.：-40℃ ----+125℃
d﹒Operating temp.：-40℃----+125℃
Ⅳ﹒GENERAL SPECIFICATION：
e﹒Remark：Products comply with RoHS'
AR-001A
molding compound
requirements
inductance drop within 10%
0
100
50
50
217
200
150
250
245
Time ( seconds )
100
150
1 50 ~ 200
/ 60 ~ 180 sec
℃
Max time above 217℃ ：60~150sec max.
Max time above 245℃ ：20~40sec max.
200℃~250℃ Average R amp-up Rate：3℃/second max.
Reflow profile
Temperatu re
Rising Area
Peak Temp：250℃ max.
Preheat Area
b
REF : 20071102-D
b﹒Wire ：Enamelled copper wire (class H)
a﹒Core：Ferrite DR core
Ⅲ﹒MATERIALS：
Ⅰ﹒CONFIGURATION & DIMENSIONS：
Ⅱ﹒SCHEMATIC DIAGRAM：
Marking
Inductance code
NAME
PROD.
B
E
A
F
F
d
1.5
2.2
1.5
ABC'S ITEM NO.
ABC'S DWG NO.
SPECIFICATION FOR APPROVAL
4.2±0.2
330K
WOUND CHIP INDUCTOR
E
:
1.2
B
:
3.2±0.2
C
:
3.2±0.2
F
:
1.0
A
:
4.5±0.3
-
+0.3
0
250
200
P eak Temperature
：
250
℃
Forced Cooling Area
6
/ secon d max.
℃
a
c
m/m
m/m
m/m
m/m
m/m
PAGE: 1


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