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EM44BM1684LBB Datasheet(PDF) 4 Page - Eorex Corporation

Part # EM44BM1684LBB
Description  512Mb (8M횞4Bank횞16) Double DATA RATE 2 SDRAM
Download  29 Pages
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Manufacturer  EOREX [Eorex Corporation]
Direct Link  http://www.eorex.com
Logo EOREX - Eorex Corporation

EM44BM1684LBB Datasheet(HTML) 4 Page - Eorex Corporation

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eorex
EM44BM1684LBB
Jan. 2008
www.eorex.com
Pin Description (Simplified)
Pin
Name
Function
J8,K8
CK,/CK
(System Clock)
CK and CK are differential clock inputs. All address and control
input signals are sampled on the crossing of the positive edge of
CK and negative edge of CK. Output (read) data is referenced to
the crossings of CK and CK (both directions of crossing).
L8
/CS
(Chip Select)
All commands are masked when CS is registered HIGH. CS
provides for external Rank selection on systems with multiple
Ranks. CS is considered part of the command code.
K2
CKE
(Clock Enable)
CKE high activates and CKE low deactivates internal clock signals
and device input buffers and output drivers. Taking CKE low
provides Precharge Power-Down and Self- Refresh operation (all
banks idle), or Active Power-Down (row Active in any bank). CKE
is synchronous for power down entry and exit and for Self-Refresh
entry. CKE is asynchronous for Self-Refresh exit. CKE must be
maintained high throughout read and write accesses. Input buffers,
excluding CK, CK, ODT and CKE are disabled during Power Down.
Input buffers, excluding CKE are disabled during Self-Refresh.
M8,M3,M7,N2,N8,
N3,N7,P2,P8,P3,
M2,P7,R2
A0~12
(Address)
Provided the row address for Active commands and the column
address and Auto Precharge bit for Read/Write commands to
select one location out of the memory array in the respective bank.
A10 is sampled during a Precharge command to determine
whether the Precharge applies to one bank (A10 LOW) or all banks
(A10 HIGH). If only one bank is to be precharged.
A0~A12:Row address ; A0~9 :Column address.
The address inputs also provide the op-code during Mode Register
Set commands.
L2,L3
BA0, BA1
(Bank Address)
BA0 - BA1 define to which bank an Active, Read, Write or
Precharge command is being applied (For 256Mb and 512Mb, BA2
is not applied). Bank address also determines if the mode register
or extended mode register is to be accessed during a MRS or
EMRS cycle.
K9
ODT
(On Die Termination)
ODT (registered HIGH) enables termination resistance internal to
the DDR2 SDRAM. When enabled, ODT is applied to each DQ,
UDQS/UDQS, LDQS/LDQS, UDM, and LDM signal. The ODT pin
will be ignored if the Extended Mode Register (EMRS(1)) is
programmed to disable ODT.
K7, L7, K3
/RAS, /CAS,
/WE
(Command Inputs)
/RAS, /CAS and /WE (along with /CS) define the command being
entered.
B7,A8,F7,E8
UDQS,/UDQS,
LDQS,/LDQS
(Data Strobe)
Output with read data, input with write data. Edge-aligned with read
data, centered in write data. LDQS corresponds to the data on
DQ0-DQ7; UDQS corresponds to the data on DQ8-DQ15. The
data strobes LDQS and UDQS may be used in single ended mode
or paired with optional complementary signals /LDQS and /UDQS
4/29


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