NUP6012PMU

http://onsemi.com

3

PACKAGE DIMENSIONS

UDFN6, 1.6x1.6, 0.5P

CASE 517AP−01

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.30 mm FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

A

B

E

D

D2

E2

BOTTOM VIEW

b

e

6X

0.10

B

0.05

A

C

C

K

6X

NOTE 3

2X

0.10 C

PIN ONE

REFERENCE

TOP VIEW

2X

0.10 C

6X

A

A1

(A3)

0.05 C

0.05 C

PLANE

SIDE VIEW

L

6X

1

3

5

6

DIM MIN

MAX

MILLIMETERS

A

0.45

0.55

A1

0.00

0.05

A3

0.13 REF

b

0.20

0.30

D

1.60 BSC

D2

1.10

1.30

E

1.60 BSC

E2

0.45

0.65

e

0.50 BSC

K

0.20

−−−

L

0.20

0.40

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

MOUNTING FOOTPRINT*

L1

DETAIL A

A1

A3

DETAIL B

OPTIONAL

MOLD CMPD

EXPOSED Cu

L

CONSTRUCTION

OPTIONAL

CONSTRUCTION

DETAIL B

DETAIL A

1.26

0.61

0.50 PITCH

0.52

6X

1.90

DIMENSIONS: MILLIMETERS

0.32

1

6X

SOLDERMASK DEFINED

L1

0.00

0.15

ON Semiconductor and

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operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

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NUP6012PMU/D

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