CPC5712

10

www.clare.com

R01

4. Manufacturing Information

4.1 Mechanical Dimensions and Printed Circuit Board Land Pattern

4.2 Tape and Reel Packaging

0.762 MAX - 0.508 MIN

(0.030 MAX - 0.020 MIN)

0.254 MAX - 0.178 MIN

(0.010 MAX - 0.007 MIN)

16-Lead SOP Package

Recommended PCB Land Pattern

Dimensions

mm

(inches)

0.051 MIN, 0.305 MAX

(0.002 MIN, 0.012 MAX)

1.447 ± 0.076

(0.057 ± 0.003)

1.829 MAX

(0.072 MAX)

PIN 1

0.635

(0.025)

0.254 ± 0.051

(0.010 ± 0.002)

6.045 ± 0.153

(0.238 ± 0.006)

4.902 ± 0.102

(0.193 ± 0.004)

3.812 ± 0.076

(0.150 ± 0.003)

0.635

(0.025)

1.55

(0.061)

0.40

(0.0157)

5.40

(0.213)

0.712 ± 0.051

(0.028 ± 0.002)

Tape and Reel Packaging for 16-Lead SOP Package

Top Cover

Tape

P = 8.00 ± 0.10

(0.315 ± 0.004)

User Direction of Feed

W = 12.00 ± 0.30

(0.472 ± 0.012)

B

(0.209 ± 0.004)

Embossment

Embossed Carrier

Top Cover

Tape Thickness

0.102 MAX.

(0.004 MAX.)

A

(0.256 ± 0.004)

330.2 DIA.

(13.00 DIA.)

NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2

K

(0.083 ± 0.004)

Dimensions

mm

(inches)