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CPC1335P Datasheet(PDF) 5 Page - Clare, Inc. |
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CPC1335P Datasheet(HTML) 5 Page - Clare, Inc. |
5 / 5 page Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1335-R05 ©Copyright 2009, Clare, Inc. All rights reserved. Printed in USA. 3/9/09 For additional information please visit our website at: www.clare.com 5 CPC1335 MECHANICAL DIMENSIONS Manufacturing Information RoHS 2002/95/EC e3 Pb Soldering For proper assembly, the component must be processed in accordance with the current revision of IPC/JEDEC standard J-STD-020. Failure to follow the recommended guidelines may cause permanent damage to the device resulting in impaired performance and/or a reduced lifetime expectancy. Washing Clare does not recommend ultrasonic cleaning or the use of chlorinated solvents. 8 Pin Flatpack Package 9.398 ± 0.127 (0.370 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 2.540 ± 0.127 (0.100 ± 0.005) 8.077 ± 0.127 (0.318 ± 0.005) 7.620 ± 0.254 (0.300 ± 0.010) 2.159 TYP. (0.085 TYP.) 2.286 MAX. (0.090 MAX.) 0.203 (0.008) 0.635 ± 0.127 (0.025 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 0.457 ± 0.076 (0.018 ± 0.003) 2.159 TYP. (0.085 TYP.) Recommended PCB Land Pattern Dimensions mm (inches) 2.54 (0.10) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) Tape and Reel Packaging for 8 Pin Flatpack Package User Direction of Feed Embossment Embossed Carrier Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 330.2 DIA. (13.00 DIA.) 18 P = 12.00 (0.472) W = 16.30 max (0.642 max) Bo = 10.30 (0.406) Ao = 10.30 (0.406) K 1 = 2.00 (0.079) Top Cover Tape K 0 = 2.70 (0.106) NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2 Dimensions mm (inches) |
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