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CPC2014NTR Datasheet(PDF) 5 Page - Clare, Inc. |
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CPC2014NTR Datasheet(HTML) 5 Page - Clare, Inc. |
5 / 5 page Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC2014N-R01 ©Copyright 2009, Clare, Inc. OptoMOS® is a registered trademark of Clare, Inc. All rights reserved. Printed in USA. 9/10/09 For additional information please visit our website at: www.clare.com 5 CPC2014N MECHANICAL DIMENSIONS RoHS 2002/95/EC e3 Pb MANUFACTURING INFORMATION Moisture Sensitivity Clare has characterized the moisture reflow sensitivity of this package, and has determined that this component must be handled in accordance with IPC/JEDEC standard J-STD-033 moisture sensitivity level (MSL), level 3 classification. Soldering Reflow Profile For proper assembly, the component must be processed in accordance with the current revision of IPC/JEDEC standard J-STD-020. Failure to follow the recommended guidelines may cause permanent damage to the device resulting in impaired performance and/or a reduced lifetime expectancy. Washing Clare does not recommend ultrasonic cleaning or the use of chlorinated solvents. 8-Lead SOIC Narrow Package Recommended PCB Land Pattern Dimensions mm (inches) 2.184 MAX (0.086 MAX) 0.838 ± 0.102 (0.033 ± 0.004) 0.381 ± 0.051 (0.015 ± 0.002) Lead to Package Standoff MIN 0.0254 (0.001) (MAX 0.102 (0.004) 0.432 ± 0.127 (0.017 ± 0.005) 0.203 ± 0.025 (0.008 ± 0.001) 1.016 ± 0.025 (0.040 ± 0.001) 5.60 (0.22) 1.30 (0.051) 0.55 (0.022) 2.54 (0.100) 9.347 ± 0.203 (0.368 ± 0.008) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.051 (0.150 ± 0.002) 2.540 TYP (0.100 TYP) Pin 1 K 0=2.7 (0.106) K 1=2.3 (0.091) 6.8 (0.268) 2.0 (0.079) B 0=10.3 (0.406) A 0=6.5 (0.256) 2.0 (0.079) 3.0 (0.118) R0.5 (0.020) 12.0 (0.472) 4.0 (0.157) 1.50 (0.059) 16.0 (0.63) 7.5 (0.295) Embossment Embossed Carrier Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 330.2 DIA. (13.00 DIA.) |
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