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TDA8922C Datasheet(PDF) 37 Page - NXP Semiconductors

Part No. TDA8922C
Description  2 X 75 W class-D power amplifier
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Maker  NXP [NXP Semiconductors]
Homepage  http://www.nxp.com
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TDA8922C Datasheet(HTML) 37 Page - NXP Semiconductors

 
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TDA8922C_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 7 September 2009
37 of 40
NXP Semiconductors
TDA8922C
2
× 75 W class-D power amplifier
For further information on temperature profiles, refer to Application Note
AN10365
“Surface mount reflow soldering description”.
16. Soldering of through-hole mount packages
16.1 Introduction to soldering through-hole mount packages
This text gives a very brief insight into wave, dip and manual soldering.
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
16.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250
°C or 265 °C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
16.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300
°C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300
°C and 400 °C, contact may be up to 5 seconds.
MSL: Moisture Sensitivity Level
Fig 32. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature


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