PBHV9050T_1

© NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 01 — 16 September 2009

8 of 12

NXP Semiconductors

PBHV9050T

8.

Test information

8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard

Q101 - Stress test qualification for discrete semiconductors, and is

suitable for use in automotive applications.

9.

Package outline

10. Packing information

[1]

For further information and the availability of packing methods, see Section 14.

Fig 11. Test circuit for switching times

R2

R1

DUT

mgd624

(probe)

450

Ω

(probe)

450

Ω

oscilloscope

oscilloscope

Fig 12. Package outline SOT23 (TO-236AB)

04-11-04

Dimensions in mm

0.45

0.15

1.9

1.1

0.9

3.0

2.8

2.5

2.1

1.4

1.2

0.48

0.38

0.15

0.09

12

3

Table 8.

Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.[1]

Type number

Package

Description

Packing quantity

3000

10000

PBHV9050T

SOT23

4 mm pitch, 8 mm tape and reel

-215

-235