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DSF05S30U Datasheet(PDF) 1 Page - Toshiba Semiconductor |
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DSF05S30U Datasheet(HTML) 1 Page - Toshiba Semiconductor |
1 / 3 page DSF05S30U 2009-05-11 1 TOSHIBA Diode Silicon Epitaxial Schottky Barrier Type DSF05S30U High Speed Switching Application Absolute Maximum Ratings (Ta = 25°C) Characteristic Symbol Rating Unit Reverse voltage VR 30 V Average forward current IO 500 * mA Surge current (10ms) IFSM 5 A Junction temperature Tj 125 °C Storage temperature range Tstg −55 to 125 °C *: Mounted on a glass-epoxy circuit board of 20 × 20 mm, pad dimensions of 4 × 4 mm. Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Electrical Characteristics (Ta = 25°C) Characteristic Symbol Test Circuit Test Condition Min Typ. Max Unit VF (1) ― IF = 10mA ― 0.23 ― VF (2) ― IF = 200mA ― 0.35 ― Forward voltage VF (3) ― IF = 500mA ― 0.40 0.45 V Reverse current IR(1) ― VR = 30V ― 5.3 50 μA Total capacitance CT ― VR = 0, f = 1 MHz ⎯ 120 ⎯ pF Marking Equivalent Circuit (top view) Handling Precaution Schottky barrier diodes have reverse current characteristic compared to the other diodes. There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage. Please take forward and reverse loss into consideration during design. JEDEC ― JEITA ― TOSHIBA 1-1E1A Weight: 4.5 mg (typ.) Unit: mm USC FP |
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