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TC2054-2.7VCTTR Datasheet(PDF) 4 Page - Microchip Technology

Part # TC2054-2.7VCTTR
Description  50 mA, 100 mA, and 150 mA CMOS LDOs with Shutdown and Error Output
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

TC2054-2.7VCTTR Datasheet(HTML) 4 Page - Microchip Technology

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TC2054/2055/2186
DS21663D-page 4
© 2009 Microchip Technology Inc.
TEMPERATURE CHARACTERISTICS
Thermal Regulation
ΔV
OUT/ΔPD
—0.04
V/W
Note 8
Thermal Shutdown Die
Temperature
TSD
160
°C
Output Noise
eN
600
nV /
√Hz
IL = IOUT
MAX
, F = 10 kHz
Response Time
(from Shutdown Mode)
tR
—60
µs
VIN = 4V
CIN = 1 µF, COUT = 10 µF
IL = 0.1 mA, Note 11
SHDN Input
SHDN Input High Threshold
VIH
60
%VIN
VIN = 2.5V to 6.0V
SHDN Input Low Threshold
VIL
——
15
%VIN
VIN = 2.5V to 6.0V
ERROR OUTPUT
Minimum VIN Operating
Voltage
VINMIN
1.0
V
IOL = 0.1 mA
Output Logic Low Voltage
VOL
400
mV
1 mA Flows to ERROR,
IOL = 1 mA, VIN = 2V
ERROR Threshold Voltage
VTH
0.95 x VR
V
See Figure 4-2
ERROR Positive Hysteresis
VHYS
—50
mV
Note 10
VOUT to ERROR Delay
tDELAY
—2
ms
VOUT from VR = 3V to 2.8V
Resistance from ERROR to
GND
RERROR
126
Ω
VDD = 2.5V, VOUT = 2.5V
Electrical Specifications: Unless otherwise noted, VDD = +2.7V to +6.0V and VSS = GND.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges:
Extended Temperature Range
TA
-40
+125
°C
Operating Temperature Range
TA
-40
+125
°C
Storage Temperature Range
TA
-65
+150
°C
Thermal Package Resistances:
Thermal Resistance, 5L-SOT-23
θ
JA
255
°C/W
ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Specifications: Unless otherwise noted, VIN = VR + 1V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C.
BOLDFACE type specifications apply for junction temperature of -40°C to +125°C.
Parameter
Sym
Min
Typ
Max
Units
Conditions
Note
1:
The minimum VIN has to meet two conditions: VIN = 2.7V and VIN = VR + VDROPOUT.
2:
VR is the regulator output voltage setting. For example: VR = 1.8V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V.
3:
TCVOUT =
4:
5:
6:
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 1.0 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
7:
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal
value at a 1V differential.
8:
Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to IMAX at VIN = 6V for T = 10 ms.
9:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction tem-
perature and the thermal resistance from junction-to-air (i.e. TA, TJ, θJA).
10: Hysteresis voltage is referenced by VR.
11: Time required for VOUT to reach 95% of VR (output voltage setting), after VSHDN is switched from 0 to VIN.
V
OUTMAX
V
OUTMIN
() 10
6
×
V
OUT
ΔT
×
-----------------------------------------------------------------------------------------


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