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MCP3008T Datasheet(PDF) 5 Page - Microchip Technology |
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MCP3008T Datasheet(HTML) 5 Page - Microchip Technology |
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5 / 40 page  © 2008 Microchip Technology Inc. DS21295D-page 5 MCP3004/3008 TEMPERATURE CHARACTERISTICS FIGURE 1-1: Serial Interface Timing. Power Requirements Operating Voltage VDD 2.7 — 5.5 V Operating Current IDD —425 225 550 µA VDD = VREF = 5V, DOUT unloaded VDD = VREF = 2.7V, DOUT unloaded Standby Current IDDS —0.005 2 µA CS = VDD = 5.0V Electrical Specifications: Unless otherwise indicated, VDD = +2.7V to +5.5V, VSS =GND. Parameters Sym Min Typ Max Units Conditions Temperature Ranges Specified Temperature Range TA -40 — +85 °C Operating Temperature Range TA -40 — +85 °C Storage Temperature Range TA -65 — +150 °C Thermal Package Resistances Thermal Resistance, 14L-PDIP θJA —70 — °C/W Thermal Resistance, 14L-SOIC θJA —108 — °C/W Thermal Resistance, 14L-TSSOP θJA —100 — °C/W Thermal Resistance, 16L-PDIP θJA —70 — °C/W Thermal Resistance, 16L-SOIC θJA —90 — °C/W ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: Unless otherwise noted, all parameters apply at VDD = 5V, VREF = 5V, TA = -40°C to +85°C, fSAMPLE = 200 ksps and fCLK = 18*fSAMPLE. Unless otherwise noted, typical values apply for VDD = 5V, TA = +25°C. Parameter Sym Min Typ Max Units Conditions Note 1: This parameter is established by characterization and not 100% tested. 2: See graphs that relate linearity performance to VREF levels. 3: Because the sample cap will eventually lose charge, effective clock rates below 10 kHz can affect linearity performance, especially at elevated temperatures. See Section 6.2 “Maintaining Minimum Clock Speed” , “Maintaining Minimum Clock Speed”, for more information. CS CLK DIN MSB IN TSU THD TSUCS TCSH THI TLO DOUT TEN TDO TR TF LSB MSB OUT TDIS NULL BIT |
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