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MS5536C Datasheet(PDF) 16 Page - Intersema Sensoric SA

Part No. MS5536C
Description  SMD Gage Pressure MODULE
Download  17 Pages
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Maker  INTERSEMA [Intersema Sensoric SA]
Homepage  http://www.meas-spec.com/
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MS5536C Datasheet(HTML) 16 Page - Intersema Sensoric SA

 
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DA5536C_002.doc
August 25th, 2008
16
0005536C1245 ECN1126
ASSEMBLY
DECOUPLING CAPACITOR
Particular care must be taken when connecting the device to power supply. A 47 µF tantalum capacitor must be
placed as close as possible of the MS5536C's VDD pin. This capacitor will stabilise the power supply during data
conversion and thus, provide the highest possible accuracy.
SOLDERING
Please refer to the application note AN808 for all soldering issues.
MOUNTING
The MS5536C can be placed with automatic Pick&Place equipment using a special vacuum nozzle. It will not be
damaged by the vacuum.
For a good mechanical stability, it is important to solder all contact pads. The Pins PEN and PV must be left
open or connected to Vdd. Do not connect to GND!
LIGHT SENSITIVITY
The MS5536C is protected against sunlight by the
cap on frontside. It is, however, important to note
that the sensor may still be slightly sensitive to
sunlight, especially to infrared light sources (Light
may also enter the negative pressure port on
backside). This is due to the strong photo effect of
silicon. As the effect is reversible there will be no
damage, but the user has to take care that in the
final product the sensor cannot be exposed to direct
light during operation. This can be achieved for
instance by placing mechanical parts with holes in
such that light cannot pass.
CONNECTING THE PRESSURE PORT
The best connection to the pressure port is
achieved with a flexible tube fitted to the full length
of the nozzle. Care should be taken to keep the
nozzle clean. The tube should be flexible enough to
minimize the mechanical stress on the module (see
Fig. 10)
Fig. 10: connection to pressure port
CLEANING
The MS5536C has been manufactured under cleanroom conditions. It is therefore recommended to assemble
the sensor under class 10’000 or better conditions. Should this not be possible, it is recommended to protect the
sensor opening during assembly from entering particles and dust. To avoid cleaning of the PCB, solder paste of
type ‘No-Clean’ shall be used.
CLEANING MIGHT DAMAGE THE SENSOR!
ESD PRECAUTIONS
The electrical contact pads are protected against ESD according to 4 kV HBM (human body model). It is
therefore essential to ground machines and personal properly during assembly and handling of the device. The
MS5536C is shipped in antistatic transport boxes. Any test adapters or production transport boxes used during
the assembly of the sensor shall be of an equivalent antistatic material.


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