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MS765 Datasheet(PDF) 2 Page - Intersema Sensoric SA |
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MS765 Datasheet(HTML) 2 Page - Intersema Sensoric SA |
2 / 6 page DA765_000.doc March 19, 2009 2/6 000007651507 ECN 1186 BOND PAD CONFIGURATION Vs+ Out- Epi Out+ GND1 GND2 MS765 Important remarks: As the sensing elements are diffused resistances, the voltage applied on the ground pads (GND1 and GND2) has to be lower than the voltage applied on supply voltage pad (Vs+). The epitaxial layer is connected to the Vs+ pin on the die. Gold ball bonding or aluminium wedge bonding can be used to wire-bond the sensor. The quality of the wire-bonding is equipment and process dependant. For this reason, it is strongly recommended that a thorough wire-bonding qualification is made by the end user if the sensor is going to be operated over an extended temperature range. LAYOUT (Absolute sensors) MS765-A_0.2 MS765-A_0.5 Pad opening in passivation is 100 µ µ µ µm |
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