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XR16M681IL32 Datasheet(PDF) 4 Page - Exar Corporation |
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XR16M681IL32 Datasheet(HTML) 4 Page - Exar Corporation |
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4 / 51 page  XR16M681 4 1.62V TO 3.63V UART WITH 32-BYTE FIFO AND VLIO INTERFACE REV. 1.0.1 Pin type: I=Input, O=Output, I/O= Input/output, OD=Output Open Drain. CTS# 18 24 A1 I UART Clear-to-Send (active low) or general purpose input. It can be used for auto CTS flow control, see EFR[7], MSR[4] and IER[7]. This input should be connected to VCC when not used. DTR# - 22 B3 O UART Data-Terminal-Ready (active low) or general purpose output. DSR# - 25 C4 I UART Data-Set-Ready (active low) or general purpose input. This input should be connected to VCC when not used. CD# - 26 - I UART Carrier-Detect (active low) or general purpose input. This input should be connected to VCC when not used. RI# - 27 - I UART Ring-Indicator (active low) or general purpose input. This input should be connected to VCC when not used. ANCILLARY SIGNALS XTAL1 8 10 D5 I Crystal or external clock input. XTAL2 9 11 C5 O Crystal or buffered clock output. PwrSave 7 9 D4 I Power-Save (active high). This feature isolates the M681’s data bus interface from the host preventing other bus activities that cause higher power drain during sleep mode. See Sleep Mode with Auto Wake-up and Power-Save Feature section for details. This pin does not have an internal pull-down resistor. This input should be con- nected to GND when not used. RESET# 17 23 A2 O Device reset (active low). A 40 ns minimum LOW pulse on this pin will reset the internal registers and all outputs of the UART. The UART transmitter output will be held HIGH, the receiver input will be ignored and outputs are reset during reset period (see UART Reset Conditions). VCC 19 28 B1 Pwr 1.62V to 3.63V power supply. GND 11 13 B5 Pwr Power supply common, ground. GND Center Pad Center Pad - Pwr The center pad on the backside of the QFN package is metallic and should be connected to GND on the PCB. The thermal pad size on the PCB should be the approximate size of this center pad and should be solder mask defined. The solder mask opening should be at least 0.0025" inwards from the edge of the PCB thermal pad. NC 13 2, 15-18 - - No Connects. Pin Description NAME 24-QFN PIN# 32-QFN PIN# 25-BGA PIN# TYPE DESCRIPTION |
Similar Part No. - XR16M681IL32 |
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Similar Description - XR16M681IL32 |
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