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XR16M554IV64 Datasheet(PDF) 7 Page - Exar Corporation |
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XR16M554IV64 Datasheet(HTML) 7 Page - Exar Corporation |
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7 / 46 page  XR16M554/554D 7 REV. 1.0.0 1.62V TO 3.63V QUAD UART WITH 16-BYTE FIFO CDA# CDB# CDC# CDD# - - - - 64 18 31 49 9 27 43 61 19 42 59 2 I UART channels A-D Carrier-Detect (active low) or gen- eral purpose input. This input should be connected to VCC when not used. This input has no effect on the UART. RIA# RIB# RIC# RID# - - - - 63 19 30 50 8 28 42 62 18 43 58 3 I UART channels A-D Ring-Indicator (active low) or gen- eral purpose input. This input should be connected to VCC when not used. This input has no effect on the UART. ANCILLARY SIGNALS XTAL1 18 25 35 50 I Crystal or external clock input. XTAL2 19 26 36 51 O Crystal or buffered clock output. 16/68# 14 - 31 - I Intel or Motorola Bus Select (input with internal pull-up). When 16/68# pin is HIGH, 16 or Intel Mode, the device will operate in the Intel bus type of interface. When 16/68# pin is LOW, 68 or Motorola mode, the device will operate in the Motorola bus type of interface. Motorola bus interface is not available on the 64 pin package. RESET (RESET#) 20 27 37 53 I When 16/68# pin is HIGH for Intel bus interface, this input becomes the Reset pin (active high). In this case, a 40 ns minimum HIGH pulse on this pin will reset the internal registers and all outputs. The UART transmitter output will be held HIGH, the receiver input will be ignored and outputs are reset during reset period (Table 13). When 16/68# pin is at LOW for Motorola bus interface, this input becomes Reset# pin (active low). This pin functions similarly, but instead of a HIGH pulse, a 40 ns minimum LOW pulse will reset the inter- nal registers and outputs. Motorola bus interface is not available on the 64 pin package. VCC 2, 24, 37 4, 21, 35, 52 13, 30, 47, 64 5, 25, 45, 65 Pwr 1.62V to 3.63V power supply. GND 21, 47 14, 28, 45, 61 6, 23, 40, 57 16, 36, 56, 76 Pwr Power supply common, ground. GND Center Pad N/A N/A N/A Pwr The center pad on the backside of the QFN package is metallic and should be connected to GND on the PCB. The thermal pad size on the PCB should be the approx- imate size of this center pad and should be solder mask defined. The solder mask opening should be at least 0.0025" inwards from the edge of the PCB thermal pad. Pin Description NAME 48-QFN PIN # 64-LQFP PIN # 68-PLCC PIN# 80-LQFP PIN # TYPE DESCRIPTION |
Similar Part No. - XR16M554IV64 |
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Similar Description - XR16M554IV64 |
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