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FAN21SV06 Datasheet(PDF) 4 Page - Fairchild Semiconductor |
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FAN21SV06 Datasheet(HTML) 4 Page - Fairchild Semiconductor |
4 / 17 page © 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN21SV06 Rev. 1.0.1 4 Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Parameter Conditions Min. Max. Units VIN, VIN_Reg to AGND AGND=PGND 28 V 5V_Reg to AGND AGND=PGND 6 V BOOT to PGND 35 V BOOT to SW -0.5 6.0 V Continuous -0.5 24.0 V SW to PGND Transient (t < 20ns, f < 600KHz) -5 30 V All other pins -0.3 6.0 V Human Body Model, JESD22-A114 1.5 ESD Charged Device Model, JESD22-C101 2.5 kV Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Conditions Min. Typ. Max Units fSW Switching Frequency 200 500 600 KHz VIN to PGND 3.0 24.0 V VIN, VIN_Reg Supply Voltage for Power and Bias VIN_Reg to AGND 6.5 24.0 V FAN21SV06MX -10 +85 °C TA Ambient Temperature FAN21SV06EMX -40 +85 °C TJ Junction Temperature +125 °C Thermal Information Symbol Parameter Min. Typ. Max. Units TSTG Storage Temperature -65 +150 °C TL Lead Soldering Temperature, 30sec +300 °C P1 (Q2) 4 °C/W P2 (Q1) 7 °C/W θJC Thermal Resistance: Junction-to-Case P3 4 °C/W θJ-PCB Thermal Resistance: Junction-to-Mounting Surface (1) 35 (1) °C/W PD Total Power Dissipation in the package, TA=25°C (1) 2.8 W Note: 1. Typical thermal resistance when mounted on a four-layer, two-ounce PCB, as shown in Figure 37. Actual results are dependent upon mounting method and surface related to the design. |
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