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I048C030T021P2 Datasheet(PDF) 5 Page - Vicor Corporation
VICOR [Vicor Corporation]
V•I Chip Intermediate Bus Converter
Page 5 of 8
V•I Chip Intermediate Bus Converter
+IN / -IN DC Voltage Input Pins
The "VIC-in-a-Brick" Intermediate Bus Converter (IBC) input voltage
range should not be exceeded. The V•I Chip BCM’s internal under/over
voltage lockout-function prevents operation outside of the normal
input range. The BCM turns ON within an input voltage window
bounded by the "Input under-voltage turn-on" and "Input over-voltage
turn-off" levels, as specified. The IBC may be protected against
accidental application of a reverse input voltage by the addition of a
rectifier in series with the positive input, or a reverse rectifier in shunt
with the positive input located on the load side of the input fuse.
Vicor recommends a minimum of 10 µF bypass capacitance be used
on-board across the +IN and –IN pins. The type of capacitor used
should have a low Q with some inherent ESR such as an electrolytic
capacitor. If ceramic capacitance is required for space or MTBF purposes,
it should be damped with approximately 0.3 Ω series resistance.
Anomalies in the response of the source will appear at the output of
the IBC multiplied by its K factor. The DC resistance of the source
should be kept as low as possible to minimize voltage deviations. This is
especially important if the IBC is operated near low or high line as the
over/under voltage detection circuitry of the BCM(s) could be activated.
ON/OFF – Primary Control
The Primary Control pin is a multifunction node that provides the
Standard "P" configuration — If the PC pin is left floating, the BCM
output is enabled. Once this port is pulled lower than 2.4 Vdc with
respect to –IN, the output is disabled. This action can be realized by
employing a relay, opto-coupler or open collector transistor. This port
should not be toggled at a rate higher than 1 Hz.
Optional "M" configuration — This is the reverse function as above:
when the PC pin is left floating , the BCM output is disabled.
Primary Auxiliary Supply
The PC pin can source up to 2.4 mA at 5.0 Vdc. (P version only)
The BCM contains watchdog circuitry that monitors output overload,
input over voltage or under voltage, and internal junction
temperatures. In response to an abnormal condition in any of the
monitored parameters, the PC pin will toggle. (P version only)
+OUT / – OUT — DC Voltage Output Pins
The 0.062" diameter + and – output pins are rated for a maximum
current of 50 A. Two sets of pins are provided for all units with a
current rating over 50 A. These pins must be connected in parallel with
minimal interconnect resistance. Within the specified operating range,
the average output voltage is defined by the Level 1 DC behavioral
model of the on board BCM(s) as defined in the appropriate BCM data
The very low output impedance of the IBC, as shown in the Product
Matrix table, reduces or eliminates the need for limited life aluminum
electrolytic or tantalum capacitors at the input of the non-isolated
Total load capacitance at the output of the IBC should not exceed the
specified maximum as shown in the Product Matrix table. Owing to the
wide bandwidth and low output impedance of the BCM, low
frequency bypass capacitance and significant energy storage may be
more densely and efficiently provided by adding capacitance at the
input of the IBC.
The BCM power train and control architecture allow bi-directional
power transfer, including reverse power processing from the BCM
output to its input. Reverse power transfer is enabled if the BCM input
is within its operating range and the BCM is otherwise enabled. The
BCM’s ability to process power in reverse significantly improves the IBC
transient response to an output load dump.
Figures 2 to 5 provide the IBC’s maximum ambient operating
temperature vs. BCM power dissipation for a variety of airflows. In
order to determine the maximum ambient environment for a given
application, the following procedure should be used:
1. Determine the maximum load powered by the IBC.
2. Determine the power dissipated at this load by the on-board BCM(s).
a) If using a 1 BCM configuration, this dissipation is found in Fig. 6
on the appropriate BCM data sheet corresponding to the output
voltage of the IBC.
b) If using a 2 BCM configuration, divide the maximum load by
two. The power dissipated by each BCM is found in Fig. 6 on the
appropriate BCM data sheet corresponding to the output voltage of
the IBC. This number should then be multiplied by two to reflect
the total dissipation.
3. Determine the airflow orientation from Fig.1.
4. Using the chart corresponding to the appropriate airflow angle,
find the curve corresponding to the airflow velocity and read the
maximum ambient operating temperature of the IBC (y-axis) based
on the total BCM power dissipation (x-axis).
For additional information on V•I Chip thermal design, please read the
"Thermal Management" section of the BCM data sheet.
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