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B048T120M30 Datasheet(PDF) 1 Page - Vicor Corporation |
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B048T120M30 Datasheet(HTML) 1 Page - Vicor Corporation |
1 / 12 page vicorpower.com 800-735-6200 V•I Chip Bus Converter Module B048F120T30 Rev. 2.5 Page 1 of 12 V•I Parameter Values Unit Notes +In to -In -1.0 to 60 Vdc +In to -In 100 Vdc For 100 ms PC to -In -0.3 to 7.0 Vdc +Out to -Out -0.5 to 30 Vdc Isolation voltage 2,250 Vdc Input to output Output current 30.0 A Continuous Peak output current 37.5 A For 1 ms Output power 300 W Continuous Peak output power 450 W For 1 ms Case temperature 225 °C During reflow MSL 5 Operating junction temperature (1) -40 to 125 °C T-Grade -55 to 125 °C M-Grade Storage temperature -40 to 125 °C T-Grade -65 to 125 °C M-Grade • 48 V to 12 V V•I Chip TM Converter • 300 Watt (450 Watt for 1 ms) • High density – 1017 W/in3 • Small footprint – 260 W/in2 • Low weight – 0.5 oz (15 g) • ZVS / ZCS isolated Sine Amplitude Converter • Typical efficiency 95% • 125°C operation (TJ) • <1 µs transient response • 3.5 million hours MTBF • No output filtering required B048F120T30 Vin = 38 - 55 V Vout = 9.50 - 13.8 V Iout = 25 A K = 1/4 Rout = 13.9 mΩ max © BCMTM Bus Converter Output Power Designator (=POUT/10) B 048 F 120 T 30 Bus Converter Module Input Voltage Designator Product Grade Temperatures (°C) Grade Storage Operating (TJ) T -40 to125 -40 to125 M -65 to 125 -55 to 125 Configuration F = J-lead T = Through hole Output Voltage Designator (=VOUT x10) Note: (1) The referenced junction is defined as the semiconductor having the highest temperature. This temperature is monitored by a shutdown comparator. Product Description The V•I Chip Bus Converter Module is a high efficiency (>95%), narrow input range Sine Amplitude Converter (SAC) operating from a 38 to 55 Vdc primary bus to deliver an isolated 9.50 V to 13.8 V secondary. The BCM may be used to power non-isolated POL converters or as an independent 9.50 – 13.8 V source. Due to the fast response time and low noise of the BCM, the need for limited life aluminum electrolytic or tantalum capacitors at the load is reduced—or eliminated—resulting in savings of board area, materials and total system cost. The BCM achieves a power density of 1017 W/in3 in a V•I Chip package compatible with standard pick-and- place and surface mount assembly process. The V•I Chip package provides flexible thermal management through its low junction-to-board and junction-to-case thermal resistance. Owing to its high conversion efficiency and safe operating temperature range, the BCM does not require a discrete heat sink in typical applications. Low junction-to-case and junction-to-lead thermal impedances assure low junction temperatures and long life in the harshest environments. B048F120M30 Absolute Maximum Ratings Part Numbering |
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