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B048T120M30 Datasheet(PDF) 1 Page - Vicor Corporation

Part # B048T120M30
Description  BCM Bus Converter
Download  12 Pages
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Manufacturer  VICOR [Vicor Corporation]
Direct Link  http://www.vicorpower.com
Logo VICOR - Vicor Corporation

B048T120M30 Datasheet(HTML) 1 Page - Vicor Corporation

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vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B048F120T30
Rev. 2.5
Page 1 of 12
V•I
Parameter
Values
Unit
Notes
+In to -In
-1.0 to 60
Vdc
+In to -In
100
Vdc
For 100 ms
PC to -In
-0.3 to 7.0
Vdc
+Out to -Out
-0.5 to 30
Vdc
Isolation voltage
2,250
Vdc
Input to output
Output current
30.0
A
Continuous
Peak output current
37.5
A
For 1 ms
Output power
300
W
Continuous
Peak output power
450
W
For 1 ms
Case temperature
225
°C
During reflow MSL 5
Operating junction temperature
(1)
-40 to 125
°C
T-Grade
-55 to 125
°C
M-Grade
Storage temperature
-40 to 125
°C
T-Grade
-65 to 125
°C
M-Grade
• 48 V to 12 V V•I Chip
TM Converter
• 300 Watt (450 Watt for 1 ms)
• High density – 1017 W/in3
• Small footprint – 260 W/in2
• Low weight – 0.5 oz (15 g)
• ZVS / ZCS isolated Sine
Amplitude Converter
• Typical efficiency 95%
• 125°C operation (TJ)
• <1 µs transient response
• 3.5 million hours MTBF
• No output filtering required
B048F120T30
Vin = 38 - 55 V
Vout = 9.50 - 13.8 V
Iout = 25 A
K = 1/4
Rout = 13.9 mΩ max
©
BCMTM
Bus Converter
Output Power
Designator
(=POUT/10)
B
048
F
120
T
30
Bus Converter
Module
Input Voltage
Designator
Product Grade Temperatures (°C)
Grade
Storage
Operating (TJ)
T
-40 to125
-40 to125
M
-65 to 125
-55 to 125
Configuration
F = J-lead
T = Through hole
Output Voltage
Designator
(=VOUT x10)
Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
Product Description
The V•I Chip Bus Converter Module is a high efficiency
(>95%), narrow input range Sine Amplitude Converter
(SAC) operating from a 38 to 55 Vdc primary bus to
deliver an isolated 9.50 V to 13.8 V secondary. The BCM
may be used to power non-isolated POL converters or as
an independent 9.50 – 13.8 V source. Due to the fast
response time and low noise of the BCM, the need for
limited life aluminum electrolytic or tantalum capacitors
at the load is reduced—or eliminated—resulting in
savings of board area, materials and total system cost.
The BCM achieves a power density of 1017 W/in3 in a
V•I Chip package compatible with standard pick-and-
place and surface mount assembly process. The V•I Chip
package provides flexible thermal management through
its low junction-to-board and junction-to-case thermal
resistance. Owing to its high conversion efficiency and
safe operating temperature range, the BCM does not
require a discrete heat sink in typical applications. Low
junction-to-case and junction-to-lead thermal
impedances assure low junction temperatures and long
life in the harshest environments.
B048F120M30
Absolute Maximum Ratings
Part Numbering


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