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UPC8178TB-E3 Datasheet(PDF) 1 Page - NEC

Part # UPC8178TB-E3
Description  SILICON MMIC LOW CURRENT AMPLIFIER FOR MOBILE COMMUNICATIONS
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Manufacturer  NEC [NEC]
Direct Link  http://www.nec.com/
Logo NEC - NEC

UPC8178TB-E3 Datasheet(HTML) 1 Page - NEC

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Caution Electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
BIPOLAR ANALOG INTEGRATED CIRCUIT
µµµµPC8178TB
SILICON MMIC LOW CURRENT AMPLIFIER
FOR MOBILE COMMUNICATIONS
Document No. P14895EJ2V0DS00 (2nd edition)
Date Published November 2000 N CP(K)
Printed in Japan
DATA SHEET
2000
©
The mark
shows major revised points.
DESCRIPTION
The
µPC8178TB is a silicon monolithic integrated circuit designed as amplifier for mobile communications. This
IC can realize low current consumption with external chip inductor which can not be realized on internal 50
wideband matched IC. This low current amplifier operates on 3.0 V.
This IC is manufactured using NEC’s 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. This
process uses direct silicon nitride passivation film and gold electrodes. These materials can protect the chip surface
from pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
Low current consumption
: ICC = 1.9 mA TYP. @ VCC = 3.0 V
Supply voltage
: VCC = 2.4 to 3.3 V
Excellent isolation
: ISL = 39 dB TYP. @ f = 1.0 GHz
ISL = 40 dB TYP. @ f = 1.9 GHz
ISL = 38 dB TYP. @ f = 2.4 GHz
Power gain
: GP = 11.0 dB TYP. @ f = 1.0 GHz
GP = 11.5 dB TYP. @ f = 1.9 GHz
GP = 11.5 dB TYP. @ f = 2.4 GHz
Gain 1 dB compression output power : PO (1 dB) =
−4.0 dBm TYP. @ f = 1.0 GHz
PO (1 dB) =
−7.0 dBm TYP. @ f = 1.9 GHz
PO (1 dB) =
−7.5 dBm TYP. @ f = 2.4 GHz
Operating frequency
: 0.1 to 2.4 GHz (Output port LC matching)
High-density surface mounting
: 6-pin super minimold package (2.0
× 1.25 × 0.9 mm)
Low weight
: 7 mg (Standard value)
APPLICATION
Buffer amplifiers on 0.1 to 2.4 GHz mobile communications system


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