TCFG series D Case

Tantalum capacitors

Rev.D

9/12

Malfunction rate as function of operating

Malfunction rate as function of circuit resistance ( /V)

temperature and rated voltage

0.01

0.02

0.03

0.06

0.1

0.2

0.3

0.5

1.0

Ratio =

Rated Voltage

Applied Voltage

1.0

0.7

0.5

0.3

0.1

20

40

60

85

Fig.3

OPERATING TEMPERATURE ( C)

0.4

0.6

0.8

1.0

2.0

4.0

6.0

0.1

0.2

0.6

0.4

3.0

1.0

2.0

RESISTANCE OF CIRCUIT (

Ω / V)

Fig.4

(4) External temperature vs. fuse blowout

(5) Power vs. fuse blowout characteristics / Product

surface temperature

260

270

280

290

300

310

320

330

340

350

360

failed

no failed

1

10

100

OPERATING TIME (

s)

Fig.5

half failed

C case

D case

0

10

20

30

40

50

60

70

80

90

100

02

4

6

8

10

9

7

5

3

1

ELECTRIC POWER (

W)

Fig.6

150

100

125

175

200

225

250

275

300

325

350

surface temp.

curve of the products(

°C)

operating time(s)

C case

D case

Note: Solder the chip at 300 C or less. If it is soldered using

a temperature higher than 300 C, open function built-in may operate.

(6) Maximum power dissipation

Warming of the capacitor due to ripple voltage balances with warming caused by Joule heating and by radiated heat.

Maximum allowable warming of the capacitor is to 5 C above ambient temperature. When warming exceeds 5 C, it can

damage the dielectric and cause a short circuit.

Power dissipation (P) = I

Ripple current

P : As shown in table at right

R : Equivalent series resistance

Notes:

1. Please be aware that when case size is changed, maximum allowable power dissipation is reduced.

2. Maximum power dissipation varies depending on the package. Be sure to use a case which will keep warming within

the limits shown in the table below.