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NTLUF4189NZ Datasheet(PDF) 2 Page - ON Semiconductor |
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NTLUF4189NZ Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 8 page NTLUF4189NZ http://onsemi.com 2 DEVICE ORDERING INFORMATION Device Package Shipping† NTLUF4189NZTAG UDFN6 (Pb−Free) 3000 / Tape & Reel NTLUF4189NZTBG UDFN6 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Schottky Diode Maximum Ratings (TJ = 25°C unless otherwise stated) Parameter Symbol Value Units Peak Repetitive Reverse Voltage VRRM 30 V DC Blocking Voltage VR 30 V Average Rectified Forward Current IF 0.5 A Thermal Resistance Ratings Parameter Symbol Max Units Junction-to-Ambient – Steady State (Note 3) RθJA 155 °C/W Junction-to-Ambient – t ≤ 5 s (Note 3) RθJA 100 Junction-to-Ambient – Steady State min Pad (Note 4) RθJA 245 MOSFET Electrical Characteristics (TJ = 25°C unless otherwise specified) Parameter Symbol Test Condition Min Typ Max Units OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage V(BR)DSS VGS = 0 V, ID = 250 μA 30 V Drain−to−Source Breakdown Voltage Temperature Coefficient V(BR)DSS/TJ ID = 250 μA, ref to 25°C 22 mV/°C Zero Gate Voltage Drain Current IDSS VGS = 0 V, VDS = 24 V TJ = 25°C 1.0 mA TJ = 85°C 10 Gate-to-Source Leakage Current IGSS VDS = 0 V, VGS = ± 8.0 V 10 mA ON CHARACTERISTICS (Note 5) Gate Threshold Voltage VGS(TH) VGS = VDS, ID = 250 mA 0.4 1.1 1.5 V Negative Threshold Temp. Coefficient VGS(TH)/TJ 3.0 mV/°C Drain−to−Source On Resistance RDS(on) VGS = 4.5 V, ID = 1.5 A 145 200 mW VGS = 3.0 V, ID = 0.5 A 185 250 VGS = 2.5 V, ID = 0.5 A 220 350 Forward Transconductance gFS VDS = 4.0 V, ID = 0.15 A 1.1 S CHARGES & CAPACITANCES Input Capacitance CISS VGS = 0 V, f = 1 MHz, VDS = 15 V 95 pF Output Capacitance COSS 15 Reverse Transfer Capacitance CRSS 10 Total Gate Charge QG(TOT) VGS = 4.5 V, VDS = 15 V; ID = 1.5 A 1.4 3.0 nC Threshold Gate Charge QG(TH) 0.2 Gate-to-Source Charge QGS 0.4 Gate-to-Drain Charge QGD 0.4 3. Surface-mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq [2 oz] including traces) 4. Surface-mounted on FR4 board using the minimum recommended pad size of 30 mm2, 2 oz. Cu. 5. Pulse Test: pulse width ≤ 300 ms, duty cycle ≤ 2% 6. Switching characteristics are independent of operating junction temperatures |
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