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NTD4910N-1G Datasheet(PDF) 1 Page - ON Semiconductor

Part # NTD4910N-1G
Description  Power MOSFET 30 V, 37 A, Single N?묬hannel, DPAK/IPAK
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NTD4910N-1G Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2009
June, 2009 − Rev. 0
1
Publication Order Number:
NTD4910N/D
NTD4910N
Power MOSFET
30 V, 37 A, Single N−Channel, DPAK/IPAK
Features
Low RDS(on) to Minimize Conduction Losses
Low Capacitance to Minimize Driver Losses
Optimized Gate Charge to Minimize Switching Losses
These are Pb−Free Devices
Applications
CPU Power Delivery
DC−DC Converters
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol
Value
Unit
Drain−to−Source Voltage
VDSS
30
V
Gate−to−Source Voltage
VGS
"20
V
Continuous Drain
Current (RqJA)
(Note 1)
Steady
State
TA = 25°C
ID
11.2
A
TA = 100°C
7.9
Power Dissipation
(RqJA) (Note 1)
TA = 25°C
PD
2.6
W
Continuous Drain
Current (RqJA)
(Note 2)
TA = 25°C
ID
8.2
A
TA = 100°C
5.8
Power Dissipation
(RqJA) (Note 2)
TA = 25°C
PD
1.37
W
Continuous Drain
Current (RqJC)
(Note 1)
TC = 25°C
ID
37
A
TC = 100°C
26
Power Dissipation
(RqJC) (Note 1)
TC = 25°C
PD
27.3
W
Pulsed Drain Current
tp=10ms
TA = 25°C
IDM
152
A
Current Limited by Package
TA = 25°C
IDmaxPkg
60
A
Operating Junction and Storage Temperature
TJ, Tstg
−55 to
175
°C
Source Current (Body Diode)
IS
23
A
Drain to Source dV/dt
dV/dt
7.0
V/ns
Single Pulse Drain−to−Source Avalanche
Energy (TJ = 25°C, VDD = 50 V, VGS = 10 V,
L = 0.1 mH, IL(pk) = 22.5 A, RG = 25 W)
EAS
25.3
mJ
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
TL
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 in sq pad size, 1 oz Cu.
2. Surface−mounted on FR4 board using the minimum recommended pad size.
CASE 369AA
DPAK
(Bent Lead)
STYLE 2
MARKING DIAGRAMS
& PIN ASSIGNMENTS
CASE 369D
IPAK
(Straight Lead
DPAK)
30 V
9.0 mW @ 10 V
RDS(on) MAX
37 A
ID MAX
V(BR)DSS
13 mW @ 4.5 V
http://onsemi.com
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
ORDERING INFORMATION
1 2
3
4
CASE 369AD
IPAK
(Straight Lead)
1
2
3
4
N−Channel
D
S
G
1
Gate
2
Drain 3
Source
4
Drain
4
Drain
2
Drain
1
Gate
3
Source
4
Drain
2
Drain
1
Gate
3
Source
Y
= Year
WW
= Work Week
4910N = Device Code
G
= Pb−Free Package
1 2
3
4


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