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R0E417250MCU00 Datasheet(PDF) 16 Page - Renesas Technology Corp |
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R0E417250MCU00 Datasheet(HTML) 16 Page - Renesas Technology Corp |
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16 / 228 page  R0E417250MCU00 User’s Manual 2. Setup REJ10J1831-0200 Rev.2.00 Jun.1, 2009 Page 16 of 228 1. Outline This chapter describes the package components, the system configuration, and the specifications of the emulator functions and operating environment. 1.1 Package Components The R0E417250MCU00 package consists of the following items. After you have unpacked the box, check if your R0E417250MCU00 contains all of these items. Table 1.1 Package components Item Quantity R0E417250MCU00 MCU board 1 Oscillator module (8 MHz) mounted on the IC21 socket 1 R0E001000FLX10 flexible cable 2 R0E417250MCU00 Release Notes (English) 1 R0E417250MCU00 Release Notes (Japanese) 1 Repair Request Sheet (English) 1 Repair Request Sheet (Japanese) 1 CD-ROM - Emulator debugger (H8SX E100 emulator debugger) - User’s Manual 1 * Please keep the R0E417250MCU00’s packing box and cushioning materials at hand for later reuse in sending the product for repairs or for other purposes. Always use the original packing box and cushioning material when transporting the MCU unit. * If you have any questions or are in doubt about any point regarding the packaged product, contact your local distributor. 1.2 Other Tool Products Required for Development To proceed with the development of a program for an H8SX-family H8SX/1700-series H8SX/1720-group MCU, the products listed below are necessary in addition to those contained in the package and listed above. Procure them separately. Table 1.2 Other tool products required for development Product Part No. Emulator main unit E100 R0E001000EMU00 100-pin 0.5-mm pitch LQFP (PLQP0100KB-A Former code: LQFP-100) R0E0100TNPFK00 * To purchase the product, contact your local distributor. |
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