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CY62157EV30 MoBL®
Document #: 38-05445 Rev. *F
Page 4 of 15
Capacitance
Tested initially and after any design or process changes that may affect these parameters.
Parameter
Description
Test Conditions
Max
Unit
CIN
Input Capacitance
TA = 25°C, f = 1 MHz,
VCC = VCC(typ)
10
pF
COUT
Output Capacitance
10
pF
Thermal Resistance
Tested initially and after any design or process changes that may affect these parameters.
Parameter
Description
Test Conditions
BGA
TSOP I
TSOP II
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 3 × 4.5 inch,
two-layer printed circuit board
72
74.88
76.88
°C/W
Θ
JC
Thermal Resistance
(Junction to Case)
8.86
8.6
13.52
°C/W
Figure 4. AC Test Loads and Waveforms
Parameters
2.5V
3.0V
Unit
R1
16667
1103
Ω
R2
15385
1554
Ω
RTH
8000
645
Ω
VTH
1.20
1.75
V
VCC
VCC
OUTPUT
R2
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
Rise Time = 1 V/ns
Fall Time = 1 V/ns
OUTPUT
V
Equivalent to:
THÉVENIN EQUIVALENT
ALL INPUT PULSES
RTH
R1
TH
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