4 / 12 page
CY62136VN MoBL®
Document #: 001-06510 Rev. *A
Page 4 of 12
Thermal Resistance[6]
Parameter
Description
Test Conditions
TSOPII
FBGA
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 4.25 x 1.125 inch,
4-layer printed circuit board
60
55
°C/W
Θ
JC
Thermal Resistance
(Junction to Case)
22
16
°C/W
AC Test Loads and Waveforms
Parameters
Value
Unit
R1
1105
Ohms
R2
1550
Ohms
RTH
645
Ohms
VTH
1.75
Volts
Data Retention Characteristics (Over the Operating Range)
Parameter
Description
Conditions[9]
Min.
Typ.[2]
Max.
Unit
VDR
VCC for Data Retention
1.0
V
ICCDR
Data Retention Current
VCC = 1.0V, CE > VCC − 0.3V,
VIN > VCC − 0.3V or VIN < 0.3V,
0.5
7.5
µA
tCDR
[6]
Chip Deselect to Data
Retention Time
0ns
tR
[7]
Operation Recovery Time
70
ns
VCC Typ
VCC
OUTPUT
R2
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
OUTPUT
V
Equivalent to: THÉVENIN EQUIVALENT
ALL INPUT PULSES
RTH
R1
VCC
OUTPUT
R2
5 pF
INCLUDING
JIG AND
SCOPE
R1
Rise Time:
1 V/ns
Fall Time:
1 V/ns
(a)
(b)
(c)
Data Retention Waveform
Note:
7. Full device operation requires linear VCC ramp from VDR to VCC(min) > 100 ms or stable at VCC(min) > 100 ms.
8. No input may exceed VCC + 0.3V
VCC(min.)
VCC(min.)
tCDR
VDR > 1.0 V
DATA RETENTION MODE
tR
CE
VCC
[+] Feedback