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CY7C1568KV18-450BZI Datasheet(PDF) 1 Page - Cypress Semiconductor

Part # CY7C1568KV18-450BZI
Description  72-Mbit DDR-II SRAM 2-Word Burst Architecture
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C1568KV18-450BZI Datasheet(HTML) 1 Page - Cypress Semiconductor

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PRELIMINARY
CY7C1566KV18, CY7C1577KV18
CY7C1568KV18, CY7C1570KV18
72-Mbit DDR-II+ SRAM 2-Word Burst
Architecture (2.5 Cycle Read Latency)
Cypress Semiconductor Corporation
198 Champion Court
San Jose
, CA 95134-1709
408-943-2600
Document Number: 001-15880 Rev. *D
Revised April 24, 2009
Features
72 Mbit density (8M x 8, 8M x 9, 4M x 18, 2M x 36)
550 MHz clock for high bandwidth
2-word burst for reducing address bus frequency
Double Data Rate (DDR) interfaces
(data transferred at 1100 MHz) at 550 MHz
Available in 2.5 clock cycle latency
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
Data valid pin (QVLD) to indicate valid data on the output
Synchronous internally self-timed writes
DDR-II+ operates with 2.5 cycle read latency when DOFF is
asserted HIGH
Operates similar to DDR-I device with 1 cycle read latency
when DOFF is asserted LOW
Core VDD = 1.8V ± 0.1V; IO VDDQ = 1.4V to VDD
[1]
Supports both 1.5V and 1.8V IO supply
HSTL inputs and variable drive HSTL output buffers
Available in 165-Ball FBGA package (13 x 15 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
JTAG 1149.1 compatible test access port
Phase-Locked Loop (PLL) for accurate data placement
Configurations
With Read Cycle Latency of 2.5 cycles:
CY7C1566KV18 – 8M x 8
CY7C1577KV18 – 8M x 9
CY7C1568KV18 – 4M x 18
CY7C1570KV18 – 2M x 36
Functional Description
The CY7C1566KV18, CY7C1577KV18, CY7C1568KV18, and
CY7C1570KV18 are 1.8V Synchronous Pipelined SRAMs
equipped with DDR-II+ architecture. The DDR-II+ consists of an
SRAM core with advanced synchronous peripheral circuitry.
Addresses for read and write are latched on alternate rising
edges of the input (K) clock. Write data is registered on the rising
edges of both K and K. Read data is driven on the rising edges
of K and K. Each address location is associated with two 8-bit
words (CY7C1566KV18), 9-bit words (CY7C1577KV18), 18-bit
words (CY7C1568KV18), or 36-bit words (CY7C1570KV18) that
burst sequentially into or out of the device.
Asynchronous inputs include an output impedance matching
input (ZQ). Synchronous data outputs (Q, sharing the same
physical pins as the data inputs D) are tightly matched to the two
output echo clocks CQ/CQ, eliminating the need for separately
capturing data from each individual DDR SRAM in the system
design.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the K or K input clocks. Writes are
conducted with on-chip synchronous self-timed write circuitry.
Table 1. Selection Guide
Description
550 MHz
500 MHz
450 MHz
400 MHz
Unit
Maximum Operating Frequency
550
500
450
400
MHz
Maximum Operating Current
x8
740
690
630
580
mA
x9
740
690
630
580
x18
760
700
650
590
x36
970
890
820
750
Note
1. The Cypress QDR-II+ devices surpass the QDR consortium specification and can support VDDQ = 1.4V to VDD.
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