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TPS62750 Datasheet(PDF) 2 Page - Texas Instruments

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Part # TPS62750
Description  High Efficiency Step-Down Converter for USB Applications
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TPS62750 Datasheet(HTML) 2 Page - Texas Instruments

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ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS
(1) (2)
RECOMMENDED OPERATING CONDITIONS
TPS62750
SLVS955 – JULY 2009 ....................................................................................................................................................................................................... www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION(1)
TA
PART NUMBER(2)
OUTPUT
PACKAGE
PACKAGE
ORDERING
PACKAGE
VOLTAGE(3)
DESIGNATOR
MARKING
-40°C to 85°C
TPS62750
Adjustable
SON 2.5×2.5 -10
DSK
TPS62750DSK
NXJ
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com
(2)
The DSK (SON-10) package is available in tape on reel. Add R suffix to order quantities of 3000 parts per reel.
(3)
Contact TI for other fixed output voltage options
Over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
UNIT
Input voltage range VIN, AVIN
(2)
–0.3 to 7.0
V
Voltage range at EN, H/L, FB
–0.3 to VIN +0.3,
≤7.0
V
Voltage on L, ILim_U, ILim_L
–0.3 to 7.0
V
Peak output current
Internally limited
A
HBM Human body model
4
kV
ESD rating(3)
CDM Charge device model
1.5
Machine model
200
V
Maximum operating junction temperature, TJ
–40 to 125
°C
Storage temperature range, Tstg
–65 to 150
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to network ground terminal.
(3)
The human body model is a 100pF capacitor discharged through a 1.5 k
Ω resistor into each pin. The machine model is a 200pF
capacitor discharged directly into each pin.
PACK
THERMAL
THERMAL
THERMAL
POWER
DERATING
AGE
RESISTANCE
RESISTANCE
RESISTANCE
RATING
FACTOR
RθJA
RθJP
RθJC
FOR TA ≤ 25°C
ABOVE TA =
25°C
DSK
60.6°C/W
6.3°C/W
40°C/W
1650mW
17mW/°C
(1)
Maximum power dissipation is a function of TJ(max), θJA and TA. The maximum allowable power
dissipation at any allowable ambient temperature is PD = [TJ(max) - TA]/θJA
(2)
This thermal data is measured with a high-K board (4 layer board according to JESD51-7 JEDEC
standard).
MIN
NOM
MAX
UNIT
Supply Voltage VIN
2.9
6
V
Output voltage range for adjustable voltage
0.8
0.85 ×
V
VIN
Operating ambient temperature, TA
–40
85
°C
Operating virtual junction temperature, TJ
–40
125
°C
2
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Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s) :TPS62750


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