Product Details

DIMENSION A

DIMENSION B

DIMENSION C

DIMENSION D

INTERFACE MATERIAL

FINISH

Notes:

Dimension C = heat sink height from bottom of the base to the top of the fin field.

ATS-51170D-C1-R0 is a subsitute item available utilizing an equivalent phase change

material (Chomerics T766).

Thermal performance data are provided for reference only. Actual performance may vary

by application.

ATS reserves the right to update or change its products without notice to improve the

design or performance.

Optional maxiGRIP™ Installation/Removal Tool Set P/N: MGT170

Contact ATS to learn about custom options available.

1)

2)

3)

4)

5)

6)

thermal Performance

For more information, to find a distributor or to place an order, visit www.qats.com or

call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).

ATS PART # ATS-51170D-C2-R0

Features & Benefits

Ultra High Performance BGA Cooling

Solutions w/ maxiGRIP™ Attachment

REV1_0908

AIR VELOCITy

THERMAL RESISTANCE

FT/MIN

M/S

°C/W (UNDUCTED FLOW)

°C/W (DUCTED FLOW)

200

1.0

300

1.5

400

2.0

500

2.5

600

3.0

700

3.5

800

4.0

18.5

15.1

13.1

11.7

10.7

9.9

9.3

12.6

17 mm

17 mm

9.5 mm

28.4 mm

BLACK- ANODIZED

SAINT-GOBAIN C1100F

maxiFLOW™ design features a low profile, spread fin

array that maximizes surface area for more effective

convection (air) cooling

maxiGRIP™ attachment applies steady, even pressure to

the component and does not require holes in the PCB

Meets Telcordia GR-63-Core Office Vibration; ETSI 300

019 Transportation Vibration; and MIL-STD-810 Shock and

Unpackaged Drop Testing standards

Comes preassembled with high performance, phase

changing, thermal interface material

Designed for low profile components from 1.5 to 2.99mm

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C

D

A

B

*Image above is for illustration purposes only.