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TPS3307-25DR Datasheet(PDF) 10 Page - Texas Instruments |
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TPS3307-25DR Datasheet(HTML) 10 Page - Texas Instruments |
10 / 14 page PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) TPS3307-18D ACTIVE SOIC D 8 75 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1YEAR/ Level-1-220C-UNLIM TPS3307-18DGN ACTIVE MSOP- Power PAD DGN 8 80 None CU NIPDAU Level-1-220C-UNLIM TPS3307-18DGNR ACTIVE MSOP- Power PAD DGN 8 2500 None CU NIPDAU Level-1-220C-UNLIM TPS3307-18DR ACTIVE SOIC D 8 2500 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1YEAR/ Level-1-220C-UNLIM TPS3307-18DRG4 PREVIEW SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS3307-25D ACTIVE SOIC D 8 75 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1YEAR/ Level-1-220C-UNLIM TPS3307-25DGN ACTIVE MSOP- Power PAD DGN 8 80 None CU NIPDAU Level-1-220C-UNLIM TPS3307-25DGNR ACTIVE MSOP- Power PAD DGN 8 2500 None CU NIPDAU Level-1-220C-UNLIM TPS3307-25DGNRG4 ACTIVE MSOP- Power PAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS3307-25DR ACTIVE SOIC D 8 2500 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1YEAR/ Level-1-220C-UNLIM TPS3307-25DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS3307-33D ACTIVE SOIC D 8 75 None CU NIPDAU Level-1-220C-UNLIM TPS3307-33DGN ACTIVE MSOP- Power PAD DGN 8 80 None CU NIPDAU Level-1-220C-UNLIM TPS3307-33DGNR ACTIVE MSOP- Power PAD DGN 8 2500 None CU NIPDAU Level-1-220C-UNLIM TPS3307-33DR ACTIVE SOIC D 8 2500 None CU NIPDAU Level-1-220C-UNLIM TPS3307-33DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, PACKAGE OPTION ADDENDUM www.ti.com 4-Mar-2005 Addendum-Page 1 |
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